Jan 27, 2014
JUKI introduces its new solder paste printer RP-1 with improved accuracy and productivity of PWB solder printing, excellent for high-density packaging of downsizing electronic devices. The printer is a solder paste printing device for PWBs to solder components, and is a keystone to maintain good quality in assembling process. RP-1 now has improved printing accuracy and productivity due to its new “Motion Screen” mechanism that aligns PWB with a screen mask (called “mask” hereinafter).
Normally, to align the position of the PWB with that of the screen, three layers of stages — X, Y and θ of PWB side — are driven independently against the fixed mask to adjust the respective position. This mechanism is not only complicated but may also cause position error. On the other hand, the newly developed “Motion Screen” drives three alignment modules attached on the outer circumference of the mask stage to adjust the position in X, Y and θ directions simultaneously in simplified structure. This allows repetitive printing accuracy of circumference fine adjustment to improve up to ±10 μm (6σ), and duration including correction and movement time reduced to six seconds: realizing both high printing accuracy and high productivity. Additionally, optional “Automatic Solder Dispenser” and “High-speed Cleaning” functions are now available, enabling higher-speed printing, stable repetitive printing accuracy and reduction of environmental load.
“Automatic Solder Dispenser” is a function to keep the dispensed solder amount optimal. This dispenser automatically supplies solders by measuring the solder’s rolling diameter with a sensor and adjusting the volume accordingly. Therefore, the printing pressure on the PWB is kept stable at all times, preventing solder paste from bleeding or blurring. Also, a complete consumption of solder paste significantly reduces discarded solders.
The “High-Speed Cleaning” function automates the mask cleaning procedure, which used to be done manually. With its specially-shaped blade scraping solder leftovers, it reduces operation time of moving the cleaning unit. Higher cleaning frequency leads to improved printing accuracy. Also, a required cleansing paper is only 8 mm, making this procedure extremely economical.
Due to recent trends in high and multi-functionality of smart devices such as smartphones, automotive Engine Control Units (ECU), medical devices and digital consumer electronics devices, the size of components have been reduced further, and density increased further. In addition to the newly released RP-1 as well as JUKI’s also recently debuted PWB inspection machine RV-1, JUKI has just released the “RX-series” high-speed compact modular mounter. These systems expand JUKI’s lineup of mounting devices, making it possible to meet our customers’ demands for high productivity, flexibility and high quality throughout the entire production line.
Juki, a global leader in high-speed SMT Assembly equipment, has shipped more than 25,000 machines worldwide since 1987. Juki has built its global image with a combination of top-quality and high-reliability machines with a reputation for world-class service and support that result in the lowest production costs for its customers. The pioneer of the modular assembly system in 1993, Juki offers flexible solutions designed for both high-volume and high mix environments.
Additionally, Juki Americas offers selective solder and stamp soldering machines backed by the largest field service group in the industry. The company recently introduced a complete line solution to include screen printers, reflow ovens and wave solder systems.
For more information, visit www.jukiamericas.com.
