SHENMAO America, Inc. Exhibits October 18-19 at IWLPC Introduces Semiconductor Packaging Materials

Oct 09, 2016

SHENMAO Technology, Inc., the World’s Major Solder Materials Provider distributes from 10 worldwide locations, Semiconductor Packaging Solder Spheres, Package on Package Solder Paste, Bumping Solder Paste, Dipping Flux, SMT Solder Paste, Low and High Temperature Solder Paste, Solder Preform, Wave Solder Bar, Solder Wire and Flux, Liquid/Paste Flux and PV Ribbon.

SHENMAO America, Inc. blends Solder Paste in San Jose, CA with Tin smelted from Tin Ore concentrate creating ultrapure virgin powder made at its Facility in Taiwan for distribution in North America.

For more information, please contact: SHENMAO America, Inc. www.shenmao.com Tel: +1-408-943-1755 e-mail: usa@shenmao.com

Registration to Conference and FREE Expo: http://www.iwlpc.com/register_now.cfm

SHENMAO America, Inc. Exhibits October 18-19 at IWLPC Introduces Semiconductor Packaging Materials news release has been viewed 628 times

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