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SHENMAO Launches the SMF-UL51 Ultra-Low-Residue Flux for No-Clean Packaging Processes

Sep 26, 2018

SHENMAO America, Inc. is pleased to introduce its SMF-UL51, which is a no-clean, halogen-free, ultra-low-residue spray flux. As the world’s major solder materials provider, SHENMAO produces SMT solder paste, laser soldering paste, cored solder wire, wave solder bar, semiconductor packaging solder spheres, wafer bumping solder paste, flux and solar PV ribbon.

Benefits of SHENMAO’s SMF-UL51 Ultra-Low-Residue Flux:

  • Designed for copper pillar bonding

  • Provides superior spraying uniformity

  • Features outstanding soldering performance

  • Ultra-low-flux residue

  • Halogen-free

SHENMAO has successfully been approved by many international well-known electronics manufacturers. The company strives to offer the best quality without compromising cost and time-to-market while providing maximum value to all customers. SHENMAO America, Inc. blends SMT solder paste at its facility in San Jose, CA for distribution in North America. For more information, please visit www.shenmao.com.


SHENMAO is dedicated to the production of solder products including Water Soluble and No-clean Solder Paste, Laser Solder Paste, Solder Preforms, Cored Solder Wire, Wave Solder Bar Alloys, Wave Soldering Fluxes, Extremely Pure Solder Powder up to Type 8, BGA and Micro BGA Solder Sphere, Wafer Level Packaging Solder Paste and Fluxes, LED Die Attach Paste, High Performance Liquid Fluxes, Solar Ribbon, Plating Anode used in PCB Fabrication, Assembly and Semiconductor Packaging Processes.

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