Nov 12, 2013 
ZESTRON, the globally leading provider of high precision cleaning products, services and training solutions for the electronics manufacturing industry, is pleased to announce that GT Yeoh, Senior Application Engineer, ZESTRON South Asia, will present “Determine Critical Cleaning Process Parameters for QFNs” at the IPC Southeast Asia Conference on Assembly and Reliability on November 20th in Bangkok, Thailand.
Quad Flat No Leads (QFNs) or Micro Lead Frame (MLF) packages are one of the fastest growing package types within the electronics industry. Complexity within the package design combined with low standoff heights inhibits the complete removal of flux residues after the soldering process. Mr. Yeoh will present the challenges to effectively clean underneath QFN components, and how partially removed residues can lead to component failure. Furthermore, he will present a technical study that determined the critical cleaning process parameters using a spray-in-air inline cleaner and an aqueous alkaline cleaning agent in order to achieve complete cleanliness underneath these devices soldered with both water soluble lead free and no-clean lead free pastes.
The IPC Southeast Asia Conference on Assembly and Reliability will be held at the Miracle Grand Convention Hotel in Bangkok Thailand. For the full technical program or to register for this event, please visit IPC.org.
Headquartered in Manassas, Virginia, and operating in more than 35 countries, ZESTRON is the globally leading provider of high precision cleaning products, services and training solutions for the electronics manufacturing industry. With six worldwide technical centers and the largest team of chemical engineers in the industry, ZESTRON’s commitment to ensuring that its customers surpass even the most stringent cleaning requirements is without equal.
For additional information and to tour one of our unparalleled technical centers, please visit www.zestron.com.
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