Feb 12, 2018 ZESTRON, the globally leading provider of high precision cleaning products, services and training solutions in the electronics manufacturing and semiconductor industries, is pleased to announce that Ravi Parthasarathy, M.S.Ch.E., Senior Application Engineer, ZESTRON Americas, will present “Jet Printed Solder Paste and Cleaning Challenges” at the IPC APEX 2018 in San Diego, CA.
Recent evidence has shown that it is becoming extremely challenging to consistently deliver the correct amount of solder using screen printing. More and more manufacturers in today’s production environment are overcoming this challenge by incorporating jet printing as an additional add-on step to add extra solder paste volume to solve such challenges. Jetting offers the flexibility to print on boards that have both miniature and large size components that need to be soldered adjacent to each other.
This paper is part of an initial study executed specifically on jet printing solder pastes using multiple cleaning agents in both spray-in-air inline and batch cleaning systems. The results are further validated by numerous customer case studies. Cleanliness levels will be measured using several recognized industry guidelines.
Ravi Parthasarathy will present during the Cleaning session on Wednesday, February 18, from 1:30 PM to 3:00 PM. For more information, please visit www.ipcapexexpo.org.
Headquartered in Manassas, Virginia, and operating in more than 35 countries, ZESTRON is the globally leading provider of high precision cleaning products, services and training solutions for the electronics and semiconductor manufacturing industries. With seven worldwide technical centers and the largest team of engineers focused on high precision cleaning, ZESTRON’s commitment to ensuring that its customers surpass even the most stringent cleaning requirements is without equal.For additional information and to tour one of our unparalleled technical centers, please visit www.zestron.com.
»
