Mar 04, 2014 
Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), announces the official opening of its new expanded Research and Development facility in Colchester, Essex, UK.
Joseph Stockunas, Group Vice President, Advanced Technology – Electronic Systems, together with invited dignitaries and guests, attended the official opening by Sir Bob Russell, Member of Parliament for Colchester.
The move to the new location in Phoenix Square, Colchester, had been planned in line with new
R & D programs with subsequent headcount expansion to further drive Nordson DAGE’s Bond Test and X-ray product development programs. The move has doubled the space and added important capability including a new cleanroom facility. The Nordson DAGE Research and Development team have already accumulated many patents for their innovative, market leading products and this move will allow acceleration of future developments to meet the exacting demands of our Bondtesting and X-ray inspection customers. Examples are the newly launched XM8000 Wafer X-ray Metrology system that leverages Nordson DAGE’s unique X-ray technology for fully automatic semiconductor wafer measurements and the 4000 Optima Bondtester, both of which are used as an integral part of the fabrication and packaging of integrated circuits or as part of quality control and product acceptance.
Mr. Stockunas commented, “This Nordson DAGE Research and Development facility is a key component of the growth expectations for Nordson and a centre of collaboration for its market leading Bond Test and X-ray inspection products, all of which have been created from the ideas developed here. This site provides opportunities for us to grow to the next level as a Company and this investment confirms the level of confidence the Nordson Corporation has in Nordson DAGE and this Research and Development facility.”
Phil Vere, President of Nordson DAGE, added further, “Excellence of our engineered products is at the core of Nordson DAGE’s success. This is a large R & D investment and will provide the platform for the growth into new markets and applications.”
Headquartered in Aylesbury, UK, Nordson DAGE is a unit of the Nordson Corporation and manufactures and supports a complete range of award winning digital X-ray inspection systems and bond test equipment for the printed circuit board assembly and semiconductor industries. For more information, visit www.nordsondage.com.
Nordson Corporation engineers, manufactures and markets differentiated products and systems used for the precision dispensing and processing of adhesives, coatings, polymers and plastics, sealants, biomaterials and other materials and for fluid management, test and inspection, UV curing and plasma surface treatment, all supported by application expertise and direct global sales and service. Nordson serves a wide variety of consumer non-durable, durable and technology end markets including packaging, nonwovens, electronics, medical, appliances, energy, transportation, construction, and general product assembly and finishing. Founded in 1954 and headquartered in Westlake, Ohio, the company has operations and support offices in more than 30 countries. Visit Nordson on the Web at www.nordson.com, www.twitter.com/Nordson_Corp or www.facebook.com/nordson.
