MIRTEC to Exhibit Complete Line of 3D AOI and SPI Inspection Systems at IPC APEX 2014

MIRTEC, “The Global Leader in Inspection Technology”, will premier its complete line of 3D AOI, and SPI Inspection Systems at IPC APEX 2014 booth #2263.  This premier technical conference and exhibition for the electronics manufacturing industry will take place March 25–27, 2014, at the Mandalay Bay Resort and Convention Center in Las Vegas.

“We are very excited about the products that we will be presenting at APEX 2014”, stated Brian D’Amico, President of MIRTEC’s North American Sales and Service Division.  “MIRTEC will be featuring two distinct lines of inspection equipment specifically designed to address both the high-end and intermediate inspection requirements associated with the electronics manufacturing industry.  MIRTEC’s PRECISION SERIES consists of our award winning 25 Mega Pixel CoaXPress MV-9 2D/3D AOI machine, paired with our 25 Mega Pixel CoaXPress MS-15 SPI system.  These high-end inspection systems are designed to address the inspection speed and defect detection requirements associated with the manufacturing of PCBs used in Smart Phones, Tablet PCs and Automotive systems.  MIRTEC’s PERFORMANCE SERIES consists of our 15 Mega Pixel M7 OMNI 2D/3D AOI machine paired with our 15 Mega Pixel MS-11 SPI system. These advanced inspection systems are designed to address Intermediate inspection requirements associated with over 90% of electronics manufacturers throughout the world.  The MS-11 and MV-7 OMNI systems are designed to provide our customers with a much needed competitive edge in this highly demanding industry.”

PRECISION SERIES:

The MV-9 2D/3D In-Line AOI Machine is configured with MIRTEC’s OMNI-VISION® 2D/3D Inspection Technology which combines an exclusive 25MP CoaXPress 2D ISIS Vision System with MIRTEC’s revolutionary Digital Multi-Frequency Quad Moiré 3D system to provide precision inspection of SMT devices on finished PCB assemblies.  The MV-9 machine also features four (4) 10 Mega Pixel Side-View Cameras in addition to the 25 Mega Pixel Top-Down Camera.

The MS-15 In-Line SPI System is configured with MIRTEC’s exclusive 25MP CoaXPress 2D ISIS Vision System providing enhanced image quality, superior accuracy and lightening fast inspection rates.  The machine uses Shadow Free Moiré Phase Shift Imaging Technology to inspect solder paste depositions on PCBs post screen print for for insufficient solder, excessive solder, shape deformity, shift of deposition and bridging.  The MS-15 uses the same robust platform as MIRTEC’s MV-9 Series.

PERFORMANCE SERIES:

The MV-7 OMNI 2D/3D In-Line AOI Machine is configured with MIRTEC’s OMNI-VISION® 2D/3D Inspection Technology which combines an exclusive 15MP 2D ISIS Vision System with MIRTEC’s revolutionary Digital Multi-Frequency Quad Moiré 3D system to provide precision inspection of SMT devices on finished PCB assemblies.  The MV-7 OMNI machine also features four (4) 10 Mega Pixel Side-View Cameras in addition to the 15 Mega Pixel Top-Down Camera.

The MS-11 In-Line SPI System is configured with MIRTEC’s exclusive 15MP 2D ISIS Vision System providing enhanced image quality, superior accuracy and incredibly fast inspection rates.  The machine uses Shadow Free Moiré Phase Shift Imaging Technology to inspect solder paste depositions on PCBs post screen print for for insufficient solder, excessive solder, shape deformity, shift of deposition and bridging.  The MS-11 uses the same robust platform as MIRTEC’s MV-7 OMNI Series.

MIRTEC also will exhibit an MV-7xi In-Line AOI System configured with one Top-Down View 10 Mega Pixel camera with a Precision 13.4 Micron Telecentric Compound Lens and four (4) 10 Mega Pixel Side-View Cameras. The MV-7xi features a 2D camera bar code reader, a high-throughput, three-stage PCB conveyor and a PCB under board support system. The system also will be configured with MIRTEC’s exclusive Intelli-Scan Laser System providing superior lifted lead detection for gull wing devices, four-point height measurement capability for co-planarity testing of BGA and CSP devices, and enhanced solder paste measurement capability.

The MV-3L Desktop AOI System is the industry’s most widely accepted five camera desktop AOI system.  This system is configured with one Top-Down View 10 Mega Pixel camera with a Precision 13.4 Micron Telecentric Compound Lens and four (4) 10 Mega Pixel Side-View Cameras. It also features the Intelli-Beam Laser System. This advanced technology provides: four-point height measurement capability for co-planarity testing of BGA and CSP devices as well as enhanced solder paste measurement capability.

The MV-2GT Desktop AOI System provides Advanced Technology to the electronics manufacturing industry at an affordable price.  The machine is configured with a single Top-Down 5 Mega Pixel Digital Color Camera System and a three stage LED Lighting System.  These systems offer superior fault coverage and will detect defects such as component presence/absence, polarity, miss alignment, insufficient solder, solder bridging, etc.  The system software is very powerful yet extremely simple to use. The standard SPC software package promotes continuous process improvement by allowing the user to track and eliminate defects on inspected assemblies.

At the booth, visitors can learn more about MIRTEC’s total quality management system software, INTELLISYS. This software suite promotes continuous process improvement by allowing the manufacturers to track and eliminate defects on inspected assemblies.

“MIRTEC has earned a solid reputation in the industry by providing unprecedented performance, quality and cost-effectiveness to the inspection environment,” continued D’Amico, “We look forward to welcoming visitors to our booth #2263 during the three day event.”

MIRTEC is a leading global supplier of automated inspection systems to the electronics manufacturing industry. 

For further information, please visit www.mirtec.com.