May 25, 2012 The SIPLACE SX 2012 North America Road Show started off as a great success. From May 14 to 18, the SIPLACE team installed a SIPLACE SX placement machine at partner Asys’s demo center in Marlborough, Massachusetts in order to prove just how fast and easy the SX Platform is able to simplify complex manufacturing challenges. During extensive private demonstrations a great number of customers and prospects were able to communicate their challenges directly to the SIPLACE team. They took a closer look at the highly flexible SIPLACE MultiStar head and the intelligent SIPLACE Random Feeder Setup amongst other SIPLACE features.
“The Road Show was a great way for us to demo the SX Platform to customers and prospects in New England”, said Greg Sturgill, Eastern USA Sales manager for SIPLACE. “In this part of the country we see a lot of prototyping and high mix production. The Road Show enabled us to show all the world class NPI and change-over capabilities of the SIPLACE SX live to our audience. We were very pleased with the high turn out and the interest shown at the event.” The idea behind the SIPLACE Road Show was to offer customers and prospects a chance to have a closer look at the SIPLACE product portfolio without having to travel too far, or only getting a short glance at a trade show. This proved to be a great concept: all participants were excited about the additional time during the private presentations which could last up to four hours. It also meant they had the chance to directly talk to the SIPLACE team about challenges in their production. Mark Ogden, SIPLACE Marketing Manager, was very content with the results of the presentations: “I could not be more pleased with the way the Road Show in New England turned out this year. Customers and Prospects alike came to the show and explained their manufacturing challenges to us. We were able to offer solutions that simplify all of these challenges using the SIPLACE SX platform and SIPLACE software, and the Road Show was a great way to demonstrate it live to them.”
Special focus on Changeover and New Product Introduction
For Customers and prospects and for the SIPLACE team alike, challenges from the areas of product changeover and WNPI took center stage during the Road Show. SIPLACE software like SIPLACE Random Setup, SIPLACE Setup Center and SiCluster Professional combined with the highly flexible SIPLACE MultiStar head, proved that there are solutions to simplify every manufacturing challenge in the SIPLACE product portfolio. For SIPLACE partner Asys the Road Show was a definite success as well: “We are very happy with the results of our collaboration with the SIPLACE team during the Road Show. It was a great opportunity for both companies to demonstrate their latest product offerings to a number of key customers from the New England area in a focused and effective atmosphere”, said Markus Wilkens, President of Asys Group Americas. After this great start, the SIPLACE Road Show will continue at various locations throughout North America and Canada in the course of the year.
Live at the SIPLACE Road Show 2012: world class NPI and
change-over capabilities of the SIPLACE SX.
More information at www.siplace.com.
At the beginning of 2011, the SIPLACE team (formerly Siemens Electronics Assembly Systems) became a business unit of ASM Pacific Technology and operates now as ASM Assembly Systems. With its SIPLACE machines and innovative manufacturing concepts, ASM Assembly Systems GmbH & Co. KG is the world’s leading manufacturer of surface mount technology (SMT) placement machines and solutions. Since its beginnings in 1985, the company has installed almost 35,000 placement machines at over 3,500 customers all over the world. Electronics manufacturers in all industries such as telecommunications, automotive, IT, consumer electronics and automation use and depend on SIPLACE's broad portfolio of solutions and services.
For more information about ASM Assembly Systems (SIPLACE), please visit www.siplace.com.
As a subsidiary of ASM International based in Almere, Netherlands, ASM Pacific Technology (ASMPT), Singapore, has developed in only a few years into the world’s leading supplier of chip assembly, bonding and packaging systems and solutions. The ASMPT Group produces and markets machines for front-end and back-end chip assembly and semiconductor packaging. The company has plants in Hong Kong, China, Singapore and Malaysia, and since January 1, 2011 in Germany. ASMPT has been listed on the Hong Kong Stock Exchange since 1989.
ASMPT is one of the stocks in the Hang Seng HK MidCap Index under the Hang Seng Composite Index, the Hang Seng Information Technology Industry Index, and the Hang Seng Hong Kong 35 Index.
For more information about ASMPT, please visit www.asmpacific.com
Please direct any reader inquiries to:
ASM Assembly Systems GmbH& Co. KG
