Mar 14, 2017 We would like to check if you have 2 units of 2nd hand ESEC 2009 SSI or 2007 FS DA machines, below is the details;
Please advise the delivery terms & lead time.
MACHINE CONFIGURATION:
- Input: Power Lead frame Loader (PLL)
- Output: Magazine Handler
- Dispenser : Dual Wire Dispenser
- Spanker: Motorized Prepress Module (MPPM)
- Indexer : Configured to TO 247 and TO 220
- Bond head: Digital Bond head4 Hot (DBH4H)
- Pick + Place: 300mm bondarm
- Chip sensor: Nanoscan
- Expansion : 8” expansion unit
- Wafer Loader: Automatic wafer loader
- Wafer table: 8” wafer table
