Oct 12, 2006
Both events are designed to serve nation�s fastest growing electronics manufacturing marketplace. The five state North Central region�consisting of Illinois, Indiana, Michigan, Ohio, and Wisconsin�is home to 20% of the nations largest electronics contract manufacturers (ECMs). The region�s electronics OEMs account for a third all U.S. output of electronics related products and equipment.
In 2007, the Electronics Assembly Show (EAS) will feature an expanded exhibition area. Its 250 exhibitors will occupy 42,000 net square feet and feature the top names in surface mount technology assembly equipment, testing and inspection equipment/services, board level components and contract services for the nation�s leading ECMs and electronic OEM level device producers. The exhibition�s 1,600 attending companies include Flextronics, Sanmina-SCI, Solectron, Celestica, IBM, Hewlett-Packard, Hitachi, NEC, Borg-Warner, Caterpillar, Ford Motor Company, GE, Honeywell, Lockheed Martin, Raytheon, Sigmatron, Toyota and Visteon.
Commenting on the growth prospects for the new Electronics Assembly Show, Canon�s group sales manager Joseph McGeachy said, �The 2006 EAP was very well attended. Leading pick and place exhibitors such as Universal Instruments, Mydata, Juki Automation, plus DJK, Digital Test, Agilent Technologies, and Teradyne all reported great results and have already planned to exhibit in the EAS 2007 event. We are already 65% booked for next year on a expanded floor plan.�
Driven by the industry�s leading experts and organized by a team with over 20 years experience in producing electronics manufacturing conferences, the Surface Mount Technology Conference will cover all aspects of the manufacturing process, with topics such as global competitiveness, lean manufacturing, six sigma, enterprise wide solutions, quality control and plant engineering. The industry�s leading experts will speak on the full spectrum of PCB manufacturing, design, packaging, assembly and test. Today�s critical issues will be addressed such as; lead free soldering, advanced packaging, bonding, stencil printing, flip chip, cleaning, reliability/testing and rework.
�The new dedicated show positioning allows us to deploy a significantly expanded electronics assembly attendee campaign on a scale never possible in prior years,� said Kevin O�Keefe, vice-president of Canon�s events division. �In this effort, we have the full support of the major industry publications like Circuits Assembly and SMT magazines, just to name a few, and we expect more to sign on shortly.�
In addition to co-locating with ATExpo, the new events will also benefit from a co-location with National Manufacturing Week and Quality Expo, which are also running September 25-27, 2007 in the Donald E. Stephens Convention Center. Both of these are long running and broad based advanced manufacturing events whose attendees historically include about 20% electronic OEMs.
Canon�s show names include Medical Design & Manufacturing (MD&M), MEDTEC, and Medical Device Technology (MDT); WestPack, EastPack, SouthPack, and MidPak; Atlantic Design & Manufacturing, Pacific Design & Manufacturing, and Design & Manufacturing South; Quality Expo and Quality Expo Detroit; International Powder & Bulk Solids and Powder & Bulk Solids Southeast; Assembly Technology Expo, Automation Technology Expo (ATX), National Manufacturing Week, and Advanced Manufacturing Exposition (AM Expo); PLASTEC, NEPCON/Assembly East, and OEM New England. For more information, visit http://www.canontradeshows.com or call 310/ 445-4200.
