SMT, PCB Electronics Industry News

Stamped Spring Pin BGA Socket for Burn-in Characterization

Feb 03, 2011

Ironwood Electronics recently introduced a new BGA socket addressing burn-in characterization requirements for BGA devices - CBT-BGA-6011.

Socket your 48 pin BGA using Extreme Temperature Socket with Superior Electrical Performance

The contactor is a stamped spring pin with 19 gram actuation force per ball and cycle life of 500,000 insertions. Low force eliminates ball sticking issues due to temperature testing. The self inductance of the contactor is 0.93 nH, insertion loss < 1 dB at 23.2 GHz and contact resistance is <16mOhms. The current capacity of each contactor is 8 amps at 80C temperature rise. Socket temperature range is -55C to +180C. Socket also features a floating guide for precise ball to pin alignment. The specific configuration of the package to be tested in the CBT-BGA-6011 is a BGA, 9x12mm, 1mm pitch, 48 position, 9x11 ball array. The socket is mounted using supplied hardware on the target PCB with no soldering, and uses smallest footprint for nearby passive components. To use, place the BGA device into the socket base and close the socket lid assembly on to the base using the latch. This socket utilizes spring loaded compression mechanism for precise actuation. This socket can be used for hand test and burn-in characterization as well as production burn-in using automated chip loading and un-loading.

Pricing for the CBT-BGA-6011 is $600 at qty 1 with reduced pricing available depending on quantity required.

Apr 06, 2011 -

8 GHz Bandwidth Socket for Intel's ICH6 (I/O Controller Hub 6) BGA Package

Mar 22, 2011 -

Stamped Spring Pin BGA Socket for IDT's FCBGA144

Mar 11, 2011 -

Elastomer Socket for Infineon's BGA221

Feb 26, 2011 -

GHz Bandwidth Socket for Dual WLCSP

Feb 14, 2011 -

Prototype and Debug 96 ball BGA with Ease

Jan 12, 2011 -

ATE Spring Pin BGA Socket for Digital Camera Processor

Dec 10, 2010 -

Spring Pin Socket for Kelvin Resistance Measurement

Nov 30, 2010 -

Package Converters Enable Testing Generation I product on Generation II System

Jul 06, 2022 -

Offline PCBA Cleaning Machine HJS-7100,rosin flux, non-clean flux,water-soluble flux cleaning machine

Jul 05, 2022 -

Semiconductor Spray Cleaning Machine HJS-9700,Semiconductor Wafer Cleaning Machine HJS-9700

Jul 04, 2022 -

Pneumatic Stencil Cleaner HJS-9000II,dual chamber stencil cleaning machine

Jul 03, 2022 -

Electric Stencil Cleaner HJS-9500, SMT Electric Stencil Cleaner HJS-9500

Jul 01, 2022 -

Screen Cleaning Machine HJS-4600, SMT Screen Cleaning Machine HJS-4600

Jun 30, 2022 -

Electric Fixture Cleaning Machine HJS-6700, SMT pallet cleaning machine, soldering pallet cleaning machine

Jun 29, 2022 -

Waste Water Treatment Machine RWT-1000, SMT Waste Water Treatment Machine RWT-1000

Jun 28, 2022 -

Gen3's Dr Chris Hunt, CTO submits an insightful paper to the journal of Surface Mount Technology

Jun 28, 2022 -

Squeegee Cleaning Machine HJS-3700,SMT Squeegee Cleaning Machine HJS-3700

Jun 27, 2022 -

Solderstar Celebrates 20 Years of Innovation

See electronics manufacturing industry news »

Stamped Spring Pin BGA Socket for Burn-in Characterization news release has been viewed 708 times

Selective Conformal Coating System - GPD SimpleCoat

Jade Series Selective Soldering Machines