Jun 01, 2011 
Finetech announces that it sold 12 bonding systems within the past year to prominent university labs and research centers. Of the 12, three systems were purchased by California universities, including a Nanofabrication Facility as well as Electrical Engineering and Physics departments.
Several machines were purchased by the University Sherbrooke and l’École Polytechnique in Canada. Other installations include an Imaging Technology Lab, a Microelectronics Research Center, an Institute for Materials Science and a Laboratory of Atomic and Solid State Physics.
Microelectronic device development centers are precise environments that demand most advanced technologies and performance. FINEPLACER® die bonders provide the ideal solution with submicron accuracy and repeatability in a flexible platform that is ideal for settings that use multiple applications. The bonders are extremely modular, and offer researchers and labs a unique spectrum of bonding and application capabilities, including thermo-compression, thermo-sonic, eutectic, indium, flip chip and gold-tin laser bar bonding, as well as an inert atmosphere and forming gas.
Tony Bosch, Sr. Development Engineer with University of California Santa Barbara’s Nanofabrication Facility said, “The Lambda bonding system has shown an alignment success rate of 100 percent, as compared to a previous system with only a 10 percent success rate. Technical support from the Finetech staff has been very responsive and helpful.”
The 12,700 ft² UCSB Nanofabrication Facility (www.nanotech.ucsb.edu) contains state-of-the-art research-scale semiconductor and thin-film process equipment. The facility is open for use to researchers from outside academic and commercial organizations. The staff provides equipment training and process consultation for research needs in lithography, thin-film deposition, reactive ion etching, and characterization tools in support of device fabrication for a variety of materials, including InP, GaAs, GaN, SiC, Si, and other novel materials.
Finetech is a leading manufacturer of innovative rework and advanced packaging and assembly equipment for the latest advanced packages. The modular design of the FINEPLACER® platform enables a multitude of applications, from reworking SMDs to the highly accurate placement of flip chips or opto-electronic components. Finetech is headquartered in Berlin, Germany, with offices in Tempe, Arizona; Manchester, New Hampshire; Shanghai, China; and Penang, Malaysia.
