Apr 07, 2008 
The manual version of the system is used for the most sophisticated die-attach tasks, such as bonding of flip chips, MEMS, MOEMS and sensors on substrate sizes up to 180 x 136 mm. The system can be equipped with different viewing equipment including a LEICA microscope or a camera-monitor magnification system.
A significant feature of the manual configuration is the FA7 heating plate, which offers the following benefits: 50 x 50 mm heating area; �high ramp rate,� programmable up to 20�C per second; excellent thermal conductivity; very low thermal expansion; programmable up to 400�C; and optional heated inert gas integration.
The motorized configuration of the FINEPLACER� Lambda provides auto-touchdown and die placement, as well as controlled bonding operation after manual alignment of die and substrate. Advantages of this version include hands-off die placement; improved process repeatability � pilot production worthy; placement of die with dimensions that exceed the optical field of view; up to 10 programmable microscope positions; upgradeable with integrated microscope measurement function and a placement mask generator.
Applications for the Lambda include eutectic soldering, Au/Sn soldering, thermo compression, thermo-/ultrasonic bonding, and adhesive technologies.
About FINETECH
FINETECH is a leading manufacturer of innovative rework and micro assembly equipment for the latest advanced packages. The modular design of the FINEPLACER� platform enables a multitude of applications, from reworking SMDs to the highly accurate placement of flip chips or opto-electronic components. FINETECH is headquartered in Berlin, Germany, with offices in Tempe, Arizona, and Shanghai, China.
