FINETECH to Exhibit Direct Component Print Solution at APEX 2009

FINETECH will showcase the Direct Component Print Module at APEX 2009 (Booth #2059), scheduled for March 31 � April 2, 2009, at the Mandalay Bay Convention Center in Las Vegas.

The Direct Component Print (DCP) Module provides a simple and reproducible method to directly paste leadless components. When integrated into a rework system, it provides an �all in one� solution for reworking QFN and MLF components. The component contact pads are precisely aligned to the stencil and fresh solder paste applied directly to the component. The component is then transferred to the reflow arm and aligned to the substrate using the vision alignment system, accurate enough for even the smallest pitches.

The DCP Module can be added to existing FINEPLACER� systems by attaching it to the side of the positioning table.

About FINETECH

FINETECH is a leading manufacturer of innovative rework and micro assembly equipment for the latest advanced packages. The modular design of the FINEPLACER� platform enables a multitude of applications, from reworking SMDs to the highly accurate placement of flip chips or opto-electronic components. FINETECH is headquartered in Berlin, Germany, with offices in Tempe, Arizona, Shanghai, China and Penang, Malaysia.