Oct 14, 2010 
The growing diversity in power electronics poses special new challenges for wave soldering. The current focus is on sufficient heat input with high-throughput requirements. SEHO’s range of nozzle geometries provides the ideal nozzle concept for every application, from single solder nozzles to a combination of different nozzle geometries. The nozzles significantly reduce typical soldering defects such as insufficient fillings, open solder joints and soldering bridges, leading to remarkable savings in post-soldering.
The changing manufacturing requirements mainly manifest themselves in the configuration of the soldering area. Here, the classic combination of a narrow solder nozzle in the first position and a broader one on the second is being reversed. The result is longer wetting times and improved heat input. Depending on the product, the throughput of the wave soldering system can be accelerated by up to 40 percent, significantly increasing productivity in electronics manufacturing.
All SEHO solder nozzles are suitable for processing lead-free solder alloys. The nozzles can be changed quickly via bayonet couplings in order to minimize retooling and maintenance times.
For more information about SEHO Systems, visit http://www.seho.de.
Since its foundation in 1973, SEHO has become the worldwide contact partner whenever soldering is involved. Company solutions are based on performance, flexibility, efficiency and technical progress. SEHO’s business activities and production organization are oriented according to the principles of sustained future-compatible development and production of machines. As a result, all applicable environmental standards are complied with meticulously. With its systems, the company provides customers with a sustained and resource economizing production facility. It continuously develops its technology in order to provide customers with a competitive advantage. For more information, visit http://www.seho.de
