SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Akrometrix to Participate in the SMTAI Spotlight 5 Panel Discussion: “Warpage Induced Defects and Component Warpage Limits”

Akrometrix to Participate in the SMTAI Spotlight 5 Panel Discussion: “Warpage Induced Defects and Component Warpage Limits”

Aug 30, 2017

Akrometrix, LLC, the leading provider of thermal warpage and strain metrology equipment to both the front- and back-end semiconductor and electronics industries, announces that Neil Hubble, Director of Engineering, will be a panelist in the upcoming SMTAI Spotlight 5 panel discussion, scheduled to take place Wednesday, Sept. 10, 2017 from 2-3 p.m. The discussion, entitled “Warpage Induced Defects and Component Warpage Limits,” will be streamed on Facebook Live.

The Spotlight 5 session will be chaired by Brook Sandy-Smith of Indium Corporation and co-chaired by Eric Moen of Akrometrix. It will feature experts and distinguished speakers who have experience in mitigating thermal warpage in many different areas of the assembly process, including PCB and component design, PCB and soldering materials, assembly and package connectivity, and inspection/metrology. Neil Hubble will lend his expertise regarding current thermal metrology methods for measuring coplanarity as well as current standards and new challenges for identifying warpage sign and shape on 3D packages. Other panelists include Alex Chan of Nokia, Martin Anselm, Ph.D., of Rochester Institute of Technology (RIT), Raiyo F. Aspandiar, Ph.D., of Intel Corporation and Dale E. Lee of Plexus Corp.

The abstract for the panel states: Warpage induced defects have been a hot topic for a long time, but the drive toward miniaturization as well as the drive for miniaturized systems-in-package are creating a host of new thermal warpage challenges. The next generation of BGAs, sockets, connectors, SiP, PoP and LGA components have even more challenges due to thinning dimensions, changing materials and packaging processes, and growing package complexity. This goes far beyond the traditional head-in-pillow defects and smile/frown warpage. Dynamic warpage and components designed to be flat at reflow temps are revealing new sources of warpage induced stress. Developing strategies such as low temperature soldering also lead to new challenges and material trade-offs. Join us for this panel discussion in which our panel of experts will be prepared to drill-down on causes and solutions to many of these challenges.

Akrometrix, LLC is pleased to participate in a panel discussion which will bring expert discussion and advice regarding a wide spectrum of challenges relating to thermal warpage.


Akrometrix is the leader in thermal warpage and strain metrology for the front-end/back-end wafer, back-end packaging/assembly, panel and the PCB/component markets. The company provides both capital equipment and test services to measure warpage and strain in temperatures from -50°C to 300°C on virtually any substrate up to 600mm x 600mm, regardless of shape. Located in Atlanta, Georgia, Akrometrix has been serving customers worldwide for more than 20 years based on technology developed at Georgia Tech. For more information, contact Akrometrix at sales@Akrometrix.com or visit www.akrometrix.com.

Oct 16, 2017 -

Akrometrix Answers the Industry’s Demand for an Ultra-Fast Tabletop Warpage Metrology System Just in Time for productronica

Aug 14, 2017 -

Akrometrix Launches New Tabletop Shadow Moiré (TTSM) at SMTA International

Jun 29, 2017 -

Akrometrix Launches New Warpage Metrology System – the Tabletop Shadow Moiré (TTSM)

Feb 15, 2017 -

Akrometrix Wins a 2017 NPI Award for Its Next Generation AXP Shadow Moiré System at APEX

Jan 10, 2017 -

Akrometrix to Showcase Next-Generation AXP Shadow Moiré System at APEX

Oct 04, 2016 -

Akrometrix Announces Next-Generation AXP Shadow Moiré System

Sep 23, 2016 -

Understanding PCB Design & Material Warpage Challenges – Learn More at SMTAI

Sep 22, 2016 -

Akrometrix Announces New Schedule for Technical Presentations

May 05, 2016 -

Akrometrix Announces the Release of the CRE6, Convection Reflow Emulation for Warpage Metrology

Apr 29, 2016 -

Akrometrix Announces the Shipment of Its 300th Shadow Moiré System

14 more news from Akrometrix »

Jul 06, 2022 -

Offline PCBA Cleaning Machine HJS-7100,rosin flux, non-clean flux,water-soluble flux cleaning machine

Jul 05, 2022 -

Semiconductor Spray Cleaning Machine HJS-9700,Semiconductor Wafer Cleaning Machine HJS-9700

Jul 04, 2022 -

Pneumatic Stencil Cleaner HJS-9000II,dual chamber stencil cleaning machine

Jul 03, 2022 -

Electric Stencil Cleaner HJS-9500, SMT Electric Stencil Cleaner HJS-9500

Jul 01, 2022 -

Screen Cleaning Machine HJS-4600, SMT Screen Cleaning Machine HJS-4600

Jun 30, 2022 -

Electric Fixture Cleaning Machine HJS-6700, SMT pallet cleaning machine, soldering pallet cleaning machine

Jun 29, 2022 -

Waste Water Treatment Machine RWT-1000, SMT Waste Water Treatment Machine RWT-1000

Jun 28, 2022 -

Gen3's Dr Chris Hunt, CTO submits an insightful paper to the journal of Surface Mount Technology

Jun 28, 2022 -

Squeegee Cleaning Machine HJS-3700,SMT Squeegee Cleaning Machine HJS-3700

Jun 27, 2022 -

Solderstar Celebrates 20 Years of Innovation

See electronics manufacturing industry news »

Akrometrix to Participate in the SMTAI Spotlight 5 Panel Discussion: “Warpage Induced Defects and Component Warpage Limits” news release has been viewed 751 times

  • SMTnet
  • »
  • Industry News
  • »
  • Akrometrix to Participate in the SMTAI Spotlight 5 Panel Discussion: “Warpage Induced Defects and Component Warpage Limits”
MSD Dry Cabinets

MSD Dry Cabinets