Christopher Associates’ Jasbir Bath to Present on Head-In-Pillow Component Soldering Defects at LA/Orange County SMTA Chapter Dinner

Christopher Associates/Koki Solder announces that Jasbir Bath, Consulting Engineer, will give a presentation about Head-in-Pillow Component Soldering Defects at the upcoming LA/O.C. SMTA Chapter Dinner, scheduled to take place Thursday, February 17, 2011 at JT Schmid’s Restaurant & Brewery in Anaheim, CA at 7 p.m.

Over the last few years, there has been an increase in the rate of Head-in-Pillow component soldering defects. The issue has occurred across a broad segment of industries including consumer, telecom and military. There are many reasons for this issue such as warpage issues of the component or board, ball co-planarity issues for BGA/CSP components and non-wetting of the component based on contamination or excessive oxidation of the component coating.

The presentation will cover some of the work done on the development of tin-lead and lead-free solder pastes to help to reduce the Head-in-Pillow defect. It also will review some of the other causes of the Head-in-Pillow defect such as printed solder paste volume, component placement and reflow profile used, and assess work in the industry on this area as well as a review of developing industry standards/programs related to this issue.

Jasbir Bath is a Consulting Engineer for Christopher Associates/Koki Solder in the Americas. He was the Corporate Lead Engineer with Solectron Corporation/Flextronics International for 10 years with a role involving tin-lead and lead-free solder process development.