SMT, PCB Electronics Industry News

TRI Receives 2019 Global Technology Award for TR7700 SV 3D

Nov 20, 2019

Test Research, Inc. announces that the company's 3D AOI system, TR7700 SV 3D, received a 2019 Global Technology Award. TRI’s representatives received the award at the productronica International trade fair held on November 12, 2019 at Munich, Germany.

The TR7700 SV 3D is equipped with TRI's Dynamic Imaging Technology capable of delivering High-Speed Inspection up to 60 cm²/s, 30% faster speed than the last model. The TR77000 SV 3D achieves True 3D profile measurements with the latest Digital Dual 3D Blue Laser Module, 10 µm optical resolution, and a 12 MP high-speed camera. Due to its versatility, the TR7700 SV 3D can serve as Pre-Reflow or Post-Reflow depending on the production needs. The platform is able to inspect large PCB boards up to 850 mm x 610 mm, being a perfect fit for multiple industries and applications.


The Global Technology Awards have recognized the very best innovations in the printed circuit assembly and packaging industries since 2005. The awards are designed to promote best practices in key areas including manufacturing quality, customer service, sales growth, innovation, and employee motivation.


Test Research, Inc. (TRI) provides the most cost-effective solutions to meet a comprehensive range of manufacturing test and inspection requirements, from Automatic Test and Inspection solutions to Manufacturing Defect Analyzers, In-Circuit Testers and Functional Testers. Learn more at http://www.tri.com.tw. For sales and service information, write to us at marketing@tri.com.tw or call +886-2-2832 8918.

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