SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Engineered Material Systems Introduces a New Two-Component Epoxy Encapsulant (506-03A/B)

Engineered Material Systems Introduces a New Two-Component Epoxy Encapsulant (506-03A/B)

Jan 28, 2018

Engineered Material Systems, a leading global supplier of adhesives, encapsulants, and conductive materials, is pleased to debut its 506-03A/B, which is a two-component epoxy system with a convenient 1:1 volumetric mix ratio designed to pass rigorous reliability requirements.

506-03A/B is a two component, black, 100 percent solids, epoxy encapsulating compound characterized by its low mixed viscosity, quick gel (~8 minutes) and its excellent resistance to thermal shock, very good electrical properties and adhesion to a variety of substrates upon cure.

506-03A/B is the latest addition to Engineered Material Systems’ extensive line of potting/encapsulating materials that can be used in a multitude of applications to pot/encapsulate electrical and electronic assemblies.

For more information about the 506-03A/B or to learn how Engineered Material Systems can define, develop and create an engineered material solution that is right for your company, visit www.emsadhesives.com.


Engineered Materials Systems, Inc. (EMS) technology focus is on adhesives, encapsulants, and conductive materials for automotive, microelectronics, and printed inks product lines. The company creates continual improvements that will guide its customers into the future. For more information, visit www.emsadhesives.com

Dec 04, 2019 -

Engineered Material Systems Introduces Linear Resistance Carbon Inks

Jun 15, 2019 -

Engineered Material Systems Introduces Durable Printed Electronics with SMT

May 13, 2019 -

Engineered Material Systems to Showcase Conductive Adhesives for Next-Generation Solar Modules at the SNEC PV Power Expo

Apr 15, 2019 -

Engineered Material Systems to Showcase Electrically Conductive Adhesives at Intersolar Europe

Feb 21, 2019 -

EMS Introduces Spin on Liquid Negative Photoresist NR-5000

Jan 15, 2019 -

Engineered Material Systems Introduces New High thermal Conductivity Die and Component Attach Adhesive

Sep 27, 2018 -

EMS introduces 5 μm thick dry film negative photoresist DF-3505 for metallization processes

Sep 13, 2018 -

Engineered Material Systems to Showcase Next-Generation Electrically Conductive Adhesives at EU PVSEC

Sep 05, 2018 -

Engineered Material Systems Introduces New Low-Temperature Cure, Low-Cost, Electrically Conductive Adhesive

Jun 11, 2018 -

Engineered Material Systems to Showcase Next Generation Electrically Conductive Adhesives at Intersolar Europe

67 more news from Engineered Materials Systems, Inc. »

Jul 06, 2022 -

Offline PCBA Cleaning Machine HJS-7100,rosin flux, non-clean flux,water-soluble flux cleaning machine

Jul 05, 2022 -

Semiconductor Spray Cleaning Machine HJS-9700,Semiconductor Wafer Cleaning Machine HJS-9700

Jul 04, 2022 -

Pneumatic Stencil Cleaner HJS-9000II,dual chamber stencil cleaning machine

Jul 03, 2022 -

Electric Stencil Cleaner HJS-9500, SMT Electric Stencil Cleaner HJS-9500

Jul 01, 2022 -

Screen Cleaning Machine HJS-4600, SMT Screen Cleaning Machine HJS-4600

Jun 30, 2022 -

Electric Fixture Cleaning Machine HJS-6700, SMT pallet cleaning machine, soldering pallet cleaning machine

Jun 29, 2022 -

Waste Water Treatment Machine RWT-1000, SMT Waste Water Treatment Machine RWT-1000

Jun 28, 2022 -

Gen3's Dr Chris Hunt, CTO submits an insightful paper to the journal of Surface Mount Technology

Jun 28, 2022 -

Squeegee Cleaning Machine HJS-3700,SMT Squeegee Cleaning Machine HJS-3700

Jun 27, 2022 -

Solderstar Celebrates 20 Years of Innovation

See electronics manufacturing industry news »

Engineered Material Systems Introduces a New Two-Component Epoxy Encapsulant (506-03A/B) news release has been viewed 681 times

  • SMTnet
  • »
  • Industry News
  • »
  • Engineered Material Systems Introduces a New Two-Component Epoxy Encapsulant (506-03A/B)
MSD Dry Cabinets

MSD Dry Cabinets