Apr 16, 2013 
ViTrox Technologies, a solutions provider of innovative, advanced and cost-effective automated vision inspection systems and equipment for the semiconductor and electronics packaging industries, will exhibit in Booth #1H60 at NEPCON China 2013, scheduled to take place April 23-25, 2013 at the Shanghai World EXPO Exhibition & Convention Center.
The company will highlight the V810 X-ray inspection system with the new Phase Shift Profileometry (PSP), a ViTrox patented technology for board warpage compensation and 100 percent pin through-hole component PCBs. Additionally, to serve market demands for small scale component inspection, the V810 is now equipped with Variable Magnification at 11 and 19 μm to provide end-users with better magnified images and resolution on small components such as 01005s and 0.2 mm CSPs.
Winner of Global Technology and NPI awards, the V810 is the latest revolution in X-ray technology inspecting double-sided PCB panels with high defect coverage, high inspection speed and an excellent call rate. The system is designed for in-line and offline use and works on both lead and lead-free solder joints. The V810’s state-of-the-art technology is based on Digital Tomosynthesis methodology and runs on a new platform with Windows 7 Professional 64bit.
Also on display, the new generation of V510 G2 Series AOI system offers greater performance for faster inspection with inspection speeds up to 55 cm2/sec for post-reflow and 65cm2/sec for pre-reflow. The system features low power consumption with a brilliant LED monitor display and improved ergonomic adjustment to increase viewing comfort (sit-stand operation). The new multi-shot imaging technology enables the system to capture up to 180 frames per second and the multi-core processing technology significantly enhances inspection time. Additionally, the monochrome color camera via solid state modeling technologies enables best-in-class color inspection.
For more information about ViTrox’s V810, visit www.vitrox.com.
