SMT, PCB Electronics Industry News

PVA Receives Patent Optical Bonding Software in Korea

Nov 24, 2021

PVA is pleased to announce that it has patented its optical bonding software in Korea. With the new patent, the software is patented throughout the US, United Kingdom, France, Italy, Germany, Hungary, Portugal and Spain, and now Korea.

PVA's focus on these types of software and hardware tools demonstrate the company’s commitment to developing technology to reduce setup times and take the guesswork out of process and application development for the growing display bonding market. This software feature combined with PVA’s Fluid Flow Vision enables the rapid setup of a critical assembly step for new bonding processes. 

The optical bonding software greatly simplifies the bonding process by providing a system that alleviates the guess-work of creating perfect bond sequences from scratch, resulting in less waste and faster time to production.

One of the most crucial and challenging steps in the optical bonding process is the final physical mating of the two substrates (e.g. glass to screen). With this patented feature, the user is able to have complete control over the sequence of events (speeds, distances, dwells, etc.) during this critical bonding step on an actual part in production. Using a single button and visual feedback on-screen, the user easily creates a live bond sequence while the machine is simultaneously learning and recording everything quietly in the background.

After the bond sequence has been completed, control is automatically handed back over to the machine to finish the rest of the bonding process. This “learned” bond sequence is then safely stored and can be easily recalled or modified for even more precise tuning.

Within the countless factors that go into making a perfect bond, this sequence must be highly controlled and finely tuned in order to not cause material leakage, trapped bubbles, or other defects that would result in a bad part. Leveraging this new functionality, users can now rapidly prototype and make production ready bond sequences with ease, providing speed and consistency to a once slow and complicated step in the optical bonding process.

PVA manufactures turnkey solutions that help its customers improve their competitiveness. This is accomplished through engineering robust processes that introduce repeatable results that reduce waste, increase throughput and lower manufacturing costs.

For more information about PVA, please contact PVA at info@pva.net or (518) 371-2684.


PVA’s customer driven solutions are utilized worldwide in applications for printed circuit assembly, semiconductor packaging, medical device manufacturing, telecommunications, solar, and consumer electronics. Throughout the changing global manufacturing landscape, from laboratory applications to advance production systems, PVA provides technologies that deliver unmatched precision and reliability.

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