SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • MacDermid Alpha Presents 'Advantages of Prefluxed Ribbon-wire in Multi busbar Interconnection' at SNEC 2021 in Shanghai, China

MacDermid Alpha Presents 'Advantages of Prefluxed Ribbon-wire in Multi busbar Interconnection' at SNEC 2021 in Shanghai, China

May 21, 2021

The Assembly Division of MacDermid Alpha Electronics Solutions will be presenting a technical paper: ‘Advantages of Prefluxed Ribbon-wire in Multi busbar Interconnection’ at the SNEC 15th(2021) International Photovoltaic Power Generation and Smart Energy Conference &Exhibitiontaking placein Shanghai, China on June 2-5,2021.

The paper, ‘Advantages of Prefluxed Ribbon-Wire in Multi Busbar Interconnection’ will be focusing on the ALPHA Ready Ribbon technology in multi busbar (MBB) cell tabbing and stringing applications.“Multi Busbar (MBB) interconnection is gaining popularity and has been in mass manufacturing to some extent. Due to the reduced cross-sectional area of the silver pad and soldering wire, the reliability of solder joints remains one of the biggest challenges in this technology. Pollution associated with fluxing operation is another major problem. In addition, lowered peel strength, wire misalignment, wire crippling and cold or dry solder joint formation are often reported issues.” said Narahari Pujari, Global Technology Manager-PV of MacDermid Alpha. “Alpha’s PV Ready Ribbon (RR), available in the prefluxed ribbon or wire promises to alleviate some of these problems. In this technology, the flux is uniformly pre-applied on the wire to a controlled amount. This flux is designed to be pliable so it does not chip or flake during handling or feeding in automated Combined Tabbing and Stringing (CTS) equipment,” he continues.

Findings from Pujari’s paper confirm that ALPHA Ready Ribbon eliminates the need for module assemblers to apply liquid flux during automated stringing operations. This virtually eliminates all the effort and costs associated with buying, storing and using a liquid flux. Excellent peel strength and minimum pollution on tools are the additional benefits of this technology. The modules assembled using ALPHA Ready Ribbon pass thermal cycling and damp heat reliability testing according to IEC specification. Results further confirm that the new ALPHA Ready Ribbon wires can be introduced to the existing multi busbar module manufacturing line at no extra costs or process change.

For more information onALPHA Solder Interconnect Technology or solutions for Photovoltaic applications, visit MacDermidAlpha.com.To register for the SNEC PV Power Expo click here.

2021 SNEC PV Power Expo
Topic:
Advantages of Prefluxed Ribbon-wire in Multi Busbar Interconnection
Speaker:Dr. Narahari S Pujari, Global Technology Manager-PV
Date/time:4th June 2021/14:00-14:15
Venue:Kerry HotelPudong,1388 Hua Mu Road, Pudong District, Shanghai, China


Through the innovation of specialty chemicals and materials under our Alpha, Compugraphics, Electrolube, Kester and MacDermid Enthone brands, we provide solutions that power electronics interconnection.We serve all global regions and every step of device manufacturing within each segment of the electronics supply chain. The experts in our Semiconductor Solutions, Circuitry Solutions, and Assembly Solutions divisions collaborate in design, implementation, and technical service to ensure success for our partner clients.Our solutions enable our customers’ manufacture of extraordinary electronic devices at high productivity and reduced cycle time. Find out more at MacDermidAlpha.com.

Sep 17, 2021 -

MacDermid Alpha Electronics Solutions to Feature ALPHA HiTech Portfolioat SMTA Empire Expo & Tech Forum

Sep 02, 2021 -

MacDermid Alpha Presents Solder Paste Solutions for PV Cell Interconnection at EU PVSEC Conference

Aug 26, 2021 -

MacDermid Alpha Announces Release of MICROFAB® EVF NiBAR Boric Acid Free Electrolytic Nickel

Aug 18, 2021 -

MacDermid Alpha Electronics Solutions to Feature High Reliability Solutions at SMTA Ohio Valley Expo& Tech Forum

Aug 13, 2021 -

MacDermid Alpha to Present Technical Paper at SMTA China South Technical Conference 2021 in Shenzhen

Apr 15, 2021 -

MacDermid Alpha Launches ALPHA CVP-390V High Reliability Solder Paste for Harsh Operating Conditions

Apr 13, 2021 -

MacDermid Alpha Receives New Product Innovation Award for ALPHA OM-372 Solder Paste

Mar 31, 2021 -

MacDermid Alpha to be a Supporting Partner at the Upcoming IMAPS Device Packaging Conference

Mar 12, 2021 -

MacDermid Alpha Launches New Ultra-Low Temperature Solder Paste capable of Soldering Heat-Sensitive Components

Mar 06, 2021 -

MacDermid Alpha Introduces Ultra-Fine Feature Solder Paste at Productronica China in Shanghai

15 more news from MacDermid Alpha Electronics Solutions »

Mar 14, 2022 -

About Yannis Electronics!

Jan 03, 2022 -

Test HeadLines

Jan 03, 2022 -

Test

Jan 03, 2022 -

Test

Jan 03, 2022 -

Test

Jan 03, 2022 -

Test

Jan 03, 2022 -

Test

Jan 03, 2022 -

Test

Jan 03, 2022 -

Test headine

Nov 29, 2021 -

Test Head Line 1

See electronics manufacturing industry news »

MacDermid Alpha Presents 'Advantages of Prefluxed Ribbon-wire in Multi busbar Interconnection' at SNEC 2021 in Shanghai, China news release has been viewed 127 times

  • SMTnet
  • »
  • Industry News
  • »
  • MacDermid Alpha Presents 'Advantages of Prefluxed Ribbon-wire in Multi busbar Interconnection' at SNEC 2021 in Shanghai, China
 Reflow System

Voidless Reflow Soldering