SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • MacDermid Alpha Presents Solder Paste Solutions for PV Cell Interconnection at EU PVSEC Conference

MacDermid Alpha Presents Solder Paste Solutions for PV Cell Interconnection at EU PVSEC Conference

Sep 02, 2021

The Assembly Division of MacDermid Alpha Electronics Solutions will present the paper “Solder Paste for Interconnecting Structured Ribbons on the Back Side of the c-Si Cells” at the upcoming virtual European PV Solar Energy Conference and Exhibition which takes place from the 6th-10th September 2021.

PV cell interconnection with structured ribbons is usually achieved by electrically conductive adhesives (ECAs) or conductive films, however both these methods have limitations. In the paper“Solder Paste for Interconnecting Structured Ribbons on the Back Side of the c-Si Cells”, Narahari S. Pujari, Senior Global Technology Manager – PV at MacDermid Alpha, will present two novel solder pastes as alternative methods for interconnecting structured ribbons.

“The use of solder pastes for interconnecting structured ribbons offers many advantages over ECAs including higher reliability, lower voiding, improved thermal and electrical conductivity as well as being a lower cost alternative” comments Narahari. “This paper will examine solder paste as an alternative joining material taking into account properties such as bonding strength, reliability, electrical and mechanical, printing, voiding, microstructure, andfast reflowing.”

Narahari will present on Monday 6th September during the Innovative Approaches for Module Concepts Oral Presentations from 17:00-18:30 CEST.

To register for the conference please visit the EU PVSEC website.

For more information on MacDermid Alpha’s range of assembly solutions for Photovoltaic applications please visit MacDermidAlpha.com.


Through the innovation of specialty chemicals and materials under our Alpha, Electrolube, Kester, Compugraphics, and MacDermid Enthone brands, MacDermid Alpha Electronics Solutions provides solutions that power electronics interconnection.  We serve all global regions and every step of device manufacturing within each segment of the electronics supply chain.  The experts in our Semiconductor Solutions, Circuitry Solutions, and Assembly Solutions divisions collaborate in design, implementation, and technical service to ensure success for our partner clients.  Our solutions enable our customers’ manufacture of extraordinary electronic devices at high productivity and reduced cycle time.

Sep 17, 2021 -

MacDermid Alpha Electronics Solutions to Feature ALPHA HiTech Portfolioat SMTA Empire Expo & Tech Forum

Aug 26, 2021 -

MacDermid Alpha Announces Release of MICROFAB® EVF NiBAR Boric Acid Free Electrolytic Nickel

Aug 18, 2021 -

MacDermid Alpha Electronics Solutions to Feature High Reliability Solutions at SMTA Ohio Valley Expo& Tech Forum

Aug 13, 2021 -

MacDermid Alpha to Present Technical Paper at SMTA China South Technical Conference 2021 in Shenzhen

May 21, 2021 -

MacDermid Alpha Presents 'Advantages of Prefluxed Ribbon-wire in Multi busbar Interconnection' at SNEC 2021 in Shanghai, China

Apr 15, 2021 -

MacDermid Alpha Launches ALPHA CVP-390V High Reliability Solder Paste for Harsh Operating Conditions

Apr 13, 2021 -

MacDermid Alpha Receives New Product Innovation Award for ALPHA OM-372 Solder Paste

Mar 31, 2021 -

MacDermid Alpha to be a Supporting Partner at the Upcoming IMAPS Device Packaging Conference

Mar 12, 2021 -

MacDermid Alpha Launches New Ultra-Low Temperature Solder Paste capable of Soldering Heat-Sensitive Components

Mar 06, 2021 -

MacDermid Alpha Introduces Ultra-Fine Feature Solder Paste at Productronica China in Shanghai

15 more news from MacDermid Alpha Electronics Solutions »

Mar 14, 2022 -

About Yannis Electronics!

Jan 03, 2022 -

Test HeadLines

Jan 03, 2022 -

Test

Jan 03, 2022 -

Test

Jan 03, 2022 -

Test

Jan 03, 2022 -

Test

Jan 03, 2022 -

Test

Jan 03, 2022 -

Test

Jan 03, 2022 -

Test headine

Nov 29, 2021 -

Test Head Line 1

See electronics manufacturing industry news »

MacDermid Alpha Presents Solder Paste Solutions for PV Cell Interconnection at EU PVSEC Conference news release has been viewed 55 times

  • SMTnet
  • »
  • Industry News
  • »
  • MacDermid Alpha Presents Solder Paste Solutions for PV Cell Interconnection at EU PVSEC Conference
PCB Manufacturing

Facility Closure