Mar 16, 2012 
CyberOptics Corporation (Nasdaq: CYBE) will debut the QX100™ – AOI Tabletop System equipped with AI2 next-generation image analysis software along with a preview of its latest in-line AOI and SPI systems at the upcoming NEPCON China exhibition, scheduled to take place April 25-27, 2012 at the Shanghai World Expo Exhibition & Convention Center. CyberOptics’ unique value-add initiatives such as one-step SPI/AOI programming, AOI-SPI correlation analysis and printer closed loop feedback capability also will be featured.
The QX100™ redefines tabletop inspection by combining the performance of an in-line inspection system with the flexibility of a tabletop system. The system features CyberOptics’ unique image acquisition technology, the Strobed Inspection Module (SIM), and is capable of inspecting component sizes down to 01005.
The sleek QX100™ is powered by AI2 (Autonomous Image Interpretation), a patented next-generation image analysis technique that provides superior defect detection capabilities, lowest false call rates and improved clarity of defect identification. With AI2 technology, programming gets faster – with a dramatic 90 percent reduction in examples, and simpler – with full support for unsupervised and semi-automatic model training. A single workflow setup makes QX100™ an ideal choice for high-mix environments. Programs created on QX100 are 100% compatible with in-line systems.
On the SPI front, CyberOptics will feature its newest 3-D SPI system, the SE500ULTRA™, designed with an all-new, ultra-fast sensor setting a new benchmark for SPI inspection speed. The sensor combined with CyberOptics’ unique ‘all-in-one’ scan algorithm positions the SE500ULTRA™ to be 30% faster than its predecessor SPI systems with zero compromise on measurement accuracy and repeatability. It also includes a Dual Illumination sensor option to further improve repeatability and reproducibility on the very smallest of paste deposits.
A sneak preview of the QX600™ system, CyberOptics’ next in-line AOI innovation after the hugely successful QX500™, also will be on display at the show. The QX600™ is designed with a new Strobe Inspection Module (SIM) with improved illumination using LED lighting and higher resolution (12 µm), enabling improved solder joint and gold finger inspection while significantly reducing reflection and shadow effects. This drives the QX600™ system to consistently deliver superior inspection capabilities and lowest false call rates while keeping its high-speed potential intact.
Also on display, will be a prototype version of the QX100i™ system – an entry-level inline AOI system aimed at providing a cost-effective inspection solution.
The CyberOptics team looks forward to welcoming visitors at booth #1G55 during the NEPCON China exhibition.
For more information, please visit www.cyberoptics.com.
