May 07, 2012 
Umut Tosun, Application Technology Manager at ZESTRON, the globally leading provider of high precision cleaning products and services, will present “Maintaining OSP Coating Integrity During the Cleaning Process” at the International Conference on Soldering and Reliability in Toronto, Ontario, Canada. The presentation is scheduled for Wednesday, May 16, 2012, at 2:00 pm at the Crowne Plaza Hotel, Toronto Airport.
Organic Solderability Preservatives (OSP’s) have become prevalent in the electronics industry as an alternative to the HASL process. Even though this is a reliable surface finish method, care must be taken during the SMT process to minimize surface thickness degradation, particularly due to reflow and cleaning.
Within this presentation, Mr. Tosun explores the main factors affecting an OSP layer, including reflow and cleaning. He will provide detailed information and empirical data regarding the effect of chemically assisted cleaning on OSP film thickness, quantify the impact of key variables and highlight how to optimize the cleaning process in order to maintain OSP integrity.
The International Conference on Soldering and Reliability will feature 30 presentations. To learn more about the conference and to register for this event, please visit http://www.smta.org/icsr/register_now.cfm.
Headquartered in Manassas, Virginia, and operating in more than 35 countries, ZESTRON is the globally leading provider of high precision cleaning products, services and training solutions for the electronics manufacturing industry. With five worldwide technical centers and the largest team of chemical engineers in the industry, ZESTRON’s commitment to ensuring that its customers surpass even the most stringent cleaning requirements is without equal.
For additional information and to tour one of our unparalleled technical centers, please visit http://www.zestron.com.
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