Jun 24, 2013 
ZESTRON, the global leading provider of high precision cleaning products, services and training solutions, is pleased to announce that Jigar Patel, M.S.Chem.Eng., Senior Process Engineer, ZESTRON, will present “Determine Critical Cleaning Process Parameters for QFNs” at the SMTA Upper Midwest Expo and Tech Forum on June 27th.
Quad Flat No Leads (QFNs) packages are one of the fastest growing package types within the electronics industry. Low standoff heights, combined with the package design, inhibit the removal of flux residues after soldering. In “Determining Critical Cleaning Process Parameters for QFNs,” Mr. Patel will discuss the industry challenges to effectively clean underneath the QFN component body, and how partially removed residues can increase the risk of component failure. Furthermore, he will present a technical study that determined the critical cleaning process parameters using a spray-in-air inline cleaner and an aqueous alkaline cleaning agent in order to achieve complete cleanliness underneath these devices soldered with both soluble lead free and no-clean lead free pastes.
The SMTA Upper Midwest Expo and Tech Forum will be held at the Embassy Suites Bloomington in Bloomington, MN, from 10:00 AM to 3:00 PM. For the full agenda or to register for this event, please visit SMTA.org.
Headquartered in Manassas, Virginia, and operating in more than 35 countries, ZESTRON is the globally leading provider of high precision cleaning products, services and training solutions for the electronics manufacturing industry. With six worldwide technical centers and the largest team of chemical engineers in the industry, ZESTRON’s commitment to ensuring that its customers surpass even the most stringent cleaning requirements is without equal.
For additional information and to tour one of our unparalleled technical centers, please visit www.zestron.com.
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