Sep 12, 2016 
Essemtec, the Swiss manufacturer of production systems for electronic assembly and packaging, today announced plans to exhibit in Booth #224 at IMAPS Pasadena, scheduled to take place Oct. 10-13, 2016 at the Pasadena Convention Center. Essemtec will demonstrate the new compact Spider jet dispenser. The Spider can utilize two dispensing valves rated at up to 150,000 dots per hour. It dispenses 3D patterns and is easily adapted to your application.
The Spider occupies only 1 m² of floor space and features linear motor drives for high accuracy: 40 µm (3σ) at full speed. Job changeover is quick with intuitive CAD import and job preparation. Mapping of heights by laser technology enables 3D applications. A mineral-cast chassis provides stability at varying temperatures. Job and quality management is integrated. An optional ISO 7 cleanroom version is available.
The Spider is capable of a variety of semiconductor packaging applications including underfill for flip chip, dam and fill chip encapsulation, glob top and cavity fill, die bonding, lid seal, thermo-compression bonding, thermal grease, 2.5/3D packaging, and copper pillar packaging.
Essemtec AG is a privately held Swiss equipment manufacturer, specializing in high speed fluid dispensing as well as flexible high-mix SMT placement solutions. Both divisions leverage the company’s vast equipment and process know-how gained since 1991 to let their customers achieve significant competitive advantages. The company’s goal is to improve its customers’ workflows, setup times, defect rates, traceability and overall manufacturing efficiency through superior software and by providing managed SMT storage.
