Aug 20, 2019 
Laserssel, the leading provider of Laser Selective Reflow (LSR) to the electronics industry, has today announced SW Systems Technology as its representative for Southwest US and Mexico.
“Signing SW Systems to represent Laserssel has brought a breath of fresh air to our sales and marketing efforts,” commented Denis Barbini, Ph.D, Managing Director of the USA for Laserssel. “Scott’s 20 plus years of EMS ownership make him and his team an ideal technical sales rep. This is going to be a very strong partner for us.”
Laser Selective Reflow (LSR) is designed to deliver a uniform defocused laser beam over a specifically tailored area on a PCB. The uniform defocused beam is controlled and delivered to the product via the BSOM (Beam Shaping Optic Module system) on user defined area. This unique feature permits the user to implement novel soldering solutions not possible with past techniques. It also allows the selective application of energy to locations that require soldering while not heating up potentially thermally sensitive areas. LSR is potentially a means to also mitigate or even eliminate the warpage of various packages. It provides super reliable and fast, only 1~3 seconds laser bonding per selected area, bonding process. It was made possible by highly uniform optic system and distinctive recipe developed by Laserssel.
In its 30th year, Southwest Systems Technology, Inc. has offices in Texas and Mexico, serving the electronic and semiconductor manufacturing industries. The company offers industry-leading capital equipment, benchtop tools and manufacturing consumables.
For more information about Southwest Systems Technology, contact Scott Fillebrown at Scott@SWSystems.com or visit www.swsystems.com.
To learn more about Laserssel, please visit www.laserssel.com.
Laserssel Corporation is a leading provider of laser selective soldering technology supporting global semi-conductor, automotive, consumer, communications, military and industrial segments. As a pioneer in selective soldering segments, Laserssel has provided customers with unique soldering capabilities to allow to solder on heat sensitive substrates that were considered to be impossible to reflow. Laserssel is now expanding its product offerings in advanced packaging, plastic and organic substrates, very thin substrates with concern of warpage and any other challenges that were difficult, if not impossible, in conventional reflow process. Combined with its extensive knowledge in laser technology and expertise in process technology, Laserssel is well positioned to help customers to solve problems in the space of packaging and assembling the next generation of electronic devices.
