Jul 17, 2003 
Amkor�s new MLF packages are a near CSP plastic encapsulated package with a copper leadframe substrate. MLF packages have perimeter pads on the bottom of the package. Thermal enhancement is provided by Amkor�s ExposedPad� technology.
The test board front side has land patterns for MLF package sizes of 2x3mm to 10x10mm in varying I/O counts. Lead pitches of these include 0.5mm, 0.65mm and 0.8mm.
The MLF side of the PCB007 Board is designed to help customers become more familiar with the placement and process characteristics
of MLF packages. The wide assortment of pad sizes and pitches provide a comprehensive over- view of MLF packages. Daisy-chain patterns on the PCB007 board complement the patterns on the components allowing continuity to be tested.
The bottom side of the PCB007 Test board provides a variety of SMD component types. The bottom of the board has LQFP Components with 0.4mm pitch and 0.3mm pitch, pads for the PBGA256 component with a 1.00mm pitch and two TSOP Type II components, the TSOP54 with a 0.8mm pitch and the TSOP86 with a 0.5mm pitch. Standard board finish for the PCB007 is Alpha Level Silver Flash. Other finishes are available upon request. Standard board thickness is 0.062". Customers always have the option of mixing and matching components to suit their requirements.
Gerber and x, y Theta data and digitized files provided by Aegis Software are included at no charge.
Large quantities as well as single pack kits are available.
