Oct 30, 2010 
“After a hurricane two years ago and the challenging business environment last year, SMTAI exceeded all reasonable expectations for attendance and customer interest,” said Matthew Holzmann, President of Christopher Associates. “We were very happy to make strong contributions to the technical program on a number of topics.”
Topics presented by the company included the development of lead-free sold solder paste for Package on Package (PoP) component manufacturing applications and the development of tin-lead and lead-free solder pastes to reduce voiding in large contact area power transistor/QFN type components. Additionally, Matthew Holzmann presented an assessment and comparison of the European and Chinese business models in solar module manufacturing.
In an effort to maximize value for users, Christopher also held a Training Seminar in conjunction with SMTAI. The seminar included technical presentations on advanced soldering materials and processes by Jasbir Bath and a presentation from Chris Shea of Shea Associates on yield improvement using solder paste inspection.
Jasbir Bath, Consulting Engineer, commented, “It is always a pleasure presenting at leading technical conferences on the good research and development done by our materials manufacturing companies, which we hope is of benefit and helps to contribute to the knowledge base in the industry.”
In addition to the company’s technical contributions, Christopher Associates exhibited solder paste inspection systems, Koki solder pastes, SMT adhesives and fluxes, Japan Unix robotic soldering systems, and Marantz AOI systems.
The company also introduced the Tagarno Magnus HD inspection system during the show, which generated significant interest. The Magnus HD is a manual inspection system developed for very high-resolution, large field inspection of bare printed circuit boards, printed circuit assemblies, medical devices and other applications where accuracy and ultra clear image reproduction is critical.
