Jan 14, 2011 
SN100C P602 D4 is completely halogen-free, which means there are no intentional halogens of F, Cl, Br or even I hidden in the chemistry. The SN100C alloy delivers a Silver-free stable microstructure in an alloy that can accommodate the long-term cyclic strains and impact strains to which a solder joint can be subjected.
The lead-free paste has smooth bright fillets with few shrinkage defects and a stable microstructure with minimal growth of the interfacial intermetallic, resulting in highly reliable solder joints. SN100C provides excellent printing and reflow in fine-pitch circuitry, low hot and cold slump, and good coalescence and wetting with no solder balls.
SN100C P603 D4 and SN100C P605 D5/D6 Dispensing Grade Completely Halogen-Free Lead-Free Solder Pastes offer superior dispensing stability with continuous deposit on pad capability. SN100C P605 D5/D6 is optimized for high precision delivery with chip components down to 01005(0402 metric). The pastes are completely halogen-free contributing to improved reliability, high productivity and cost reduction.
SN100C (044) Completely Halogen-Free High Workability Flux-Cored Solder Wire has a high first pass yield contributed to its excellent wettability and spreading, while providing an approximately 30 percent faster soldering speed in manual soldering when compared to the previous halogen-free flux-cored solder wire.
NS-F900 is a robust, heat resistant, no-clean rosin containing wave soldering flux that is completely halogen-free. It provides high performance with high preheat temperature profiles, allowing high topside board temperatures (up to 125°C) and long dwell times that may be required for thick boards and dense, complex assemblies while being environmentally friendly. NS-F900 is specifically designed for use with SN100C (Sn-Cu-Ni+Ge) lead-free solder but is applicable to all lead-free alloys as well as Sn/Pb in wave soldering.
NS-F900 is designed to provide good hole-fill and easy solder joint inspection with little residue, while meeting JIS and J-STD-004 Surface Insulation Resistance requirements. The flux’s excellent drainage results in reduced bridging and solder shorts.
SN100C Lead-free BGA Solder Spheres have high impact strength comparable to tin-lead for BGA, CSP, MCM and other high density area-array packages. The nickel-stabilized interfacial intermetallic is free of the incipient cracking that reduces resistance to impact loading in other lead-free solders.
Nihon Superior was founded in 1966 when it began marketing unique flux products imported from the US. The company made its mark on society by gathering the most advanced soldering and brazing technologies and products from around the world, and supplying them to companies in the metal-joining industry. A turning point for the company came when it started developing its own soldering materials and with the success of its unique SN100C lead-free solder alloy Nihon Superior has become a major player in the global market. To support the growing demand for its products Nihon Superior has established manufacturing and sales centers in Japan, China and other Asian countries and formed business partnerships with companies in other markets.
