Saki Saki 3D SPI machine

3D Solder Paste Inspection Machine 

Features :

Easy to use by fully motorize X-Y scan mechanism.

Easy to program by Gerber image navigator

Easy to repeat the same job by loading the saved program

User-friendly color image live view operation

Easy to monitor various 3D measurement data (Min./Max./Avg.

Height,volume data and 3D shape image)

Easytomeasure2DdatawithinF.O.V(distance&area)

More precise 3D data review by single cross-section profile

3D inspection function(Height/Volume/Coplanarity)

SPC software including various charts& reports

Warpage compensation

The Importance of True 3D Solder measurement

The key factors of solder paste quality are its height, volume

and shape.

2D images provide only color, brightness and area information

but not key factors..

3D measurement must be required to get information related

to height, volume and shape.

At least 50% defects of SMT manufacturing process occurs

only during printing.

The worse the quality of solder paste is,the more placement

defects occur.

The reliability of electronic products directly links to the solder

joint quality and the quality of solder joint is effected by solder

pastes height, volume and shape.

Without 3D solder measurement,there is no way to check the

exact quality of printing.

The earlier defects are found, the less repair cost is required.SMT DEFECT SPECTRUM OF THE PRINTING PROCESS

NO SOLDER

INSUFFICIENT SOLDER

EXCESSIVE SOLDER

BRIDGING  

50-60%

Most people put all the emphasis on the AOI machine to

detect the above defects which can  be controlled effectively

with a 3D SPI measurement system even before going

through the reflow process