Jun 28, 2001 The Mega� II wash and rinse cycles incorporate a highly effective spray under immersion process, with strategically located venturi nozzles for maximum cleaning efficiency. The agitation can be controlled to handle sensitive wire bonded substrates or hard to clean, tight tolerance flip chip technology. An ultrasonics assist is available as an option for extremely tough cleaning requirements.
A new Pre-Wash feature for the Mega� II allows it to operate in conjunction with AAT's patented closed-loop regenerative cleaning process, and allows for an optional dual chemistry cleaning process that dramatically increases throughput capabilities and decreases periodic maintenance requirements and operating costs. The Pre-Wash feature permits several chemistry choices, including DI water, organic solvents and alcohols, thus providing more diversified cleaning alternatives.
The Mega � II is used for a multitude of applications including precision cleaning for pre-wire bonding applications and pre-conformal coating, as well as tight-tolerance cleaning under flip chip and post ball attachment cleaning of BGAs. The fully automated cleaner comes with precision process control, data logging and ultrasonic capabilities with applications in critical metal parts cleaning.
The Mega� II Cleaner is an environmentally friendly, cost effective, closed loop cleaning system. This system allows users to obtain reliably clean electronic assemblies without creating an internal hazardous liquid waste stream. For more information, visit http://www.aat-corp.com or contact Austin American Technology Corporation, 12201-160 Technology Blvd., Austin, TX 78727-6102 USA, Tel. (512) 335-6400, Fax (512) 335-5753.
