Feb 13, 2013 
ZESTRON, the global leading provider of high precision cleaning products, services and training solutions is pleased to announce that ZESTRON America’s accredited application engineers will be presenting at the IPC APEX 2013. Umut Tosun, Application Technology Manager, will present “Cleanliness Assessment for Class III Lead-Free No-Clean Assemblies” during the Cleaning II session on Wednesday, February 20th, at 1:30 PM PST.
For Class III products or mission critical electronics, the highest electronic reliability is a requirement. Partially removed or untouched residues can lead to in-field product failures resulting from electrical leakage currents, dendrite growth and electrochemical migration. In “Cleanliness Assessment for Class III Lead-Free No-Clean Assemblies,” Mr. Tosun will present the studies that identified an aqueous cleaning process capable of removing combinations of no-clean flux residues for these assemblies.
Furthermore, Ravi Parthasarathy, M.S.Chem.Eng., Senior Process Engineer, will present “Cleaning Package on Package Assemblies” at the IPC/NPL Cleaning and Contamination Testing Center, booth #1549. This presentation addresses the cleanliness level of PoP assemblies including underneath PoP components and in between packages and confirms the effectiveness of cleaning technologies for this rapidly evolving technology. “Cleaning Package on Package Assemblies” is scheduled for Wednesday, February 20th, at 3:00 PM PST.
Headquartered in Manassas, Virginia, and operating in more than 35 countries, ZESTRON is the globally leading provider of high precision cleaning products, services and training solutions for the electronics manufacturing industry. With six worldwide technical centers and the largest team of chemical engineers in the industry, ZESTRON’s commitment to ensuring that its customers surpass even the most stringent cleaning requirements is without equal.
For additional information and to tour one of our unparalleled technical centers, please visit www.zestron.com.
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