BREAKING NEWS
NEW PRODUCT SERIES LAUNCHED
The T-5000series Die Bonder is what we would like to call an evolution. The result of 40 years experience in developing high quality Die Bonder is based on a new frame concept and fulfils highest requirements for up- to-date applications in R&D and small scall productions of the worldwide microelectronic industry.
With increased travel range and our TRUE VERTICAL TECHNOLOGY, higher rigidity, increased image quality and new T-Suite software features, the T-5000serie achieves repeatable accuracy not compromising the proved flexibility and ergonomics.
T-4909-AE
The T-4909-AE is Tresky's 40-year anniversary model. On basis of the T-4909 we developed a new software running on an integrated embedded PC. Like all Tresky Die Bonder this pick & place system operates with True Vertical Technology™. The increased travel range, now 95mm on Z, allows working on various bonding heights for Epoxy-, Eutectic- and Flip-Chip processes.
Online Product Demonstration
We would be happy to give you the opportunity to get to know our Tresky chip bonding solutions at a virtual machine demonstration in our brand new showroom. We are equipped and ready for you. To make an appointment, please contact:
Tel. +41 44 772 19 41
tresky_at_tresky.com
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Trade shows 2024
Show |
Date |
Location |
Hall / Booth |
|
NEPCON | 24 - 26 January | Japan | Tokyo | Tokyo Big Sight, Hall 3, Booth E32-1A | Technoalpha | |
THERMAL24 IMAPS | 31 January - 01 February | France | La Rochelle | Mercure Oceanide | Accelonics France | |
SEMICON Korea |
31 January - 02 February |
Korea | Seoul | COEX, Booth C128 | 3H Corporation Ltd. | |
APEC | 26 -28 February | USA | Long Beach | CA | Long Beach Convention Center | Tresky Corp. | |
SEMICON China | 20 - 22 March | China | Shanghai | Shanghai New International Expo Centre | MPS | |
Fast - Engineering Solutions Live | 21 March | UK | Gaydon | British Motor Museum | Inseto | |
MicroTech24 IMAPS | 10 April | UK | Bristol | Aerospace Bristol, Patchway | Inseto | |
Battery Tech Expo | 25 April | UK | Silverstone | The Wing, Silverstone Circuit, Booth B19 | Inseto | |
IMAPS New England | 07 May |
USA | Massachusetts | MA |
Boxboro Regency Hotel & Conference Center | Booth 413 | |
Advanced Packaging For Power Electronics |
08-09 May | USA | Massachusetts | MA | Crown Plaza Boston-Woburn | Tresky Corp. | |
PCIM | 11 - 13 June |
Germany | Nuremberg |
NuernbergerMesse Hall5 / Booth 326 | Dr. Tresky AG | |
NordPac IMAPS | 11 - 13 June | Finland | Tempere | Scandic Rosendahl | Inseto | |
JPCA | 12 - 14 June | Japan | Tokyo | Tokyo Big Sight, | Technoalpha | |
MiNaPad IMAPS | 19 - 20 June | France | Grenoble | Convention Centre Grenoble | Accelonics France | |
NEPCON | 19 - 22 June | Thailand | Bangkok | BITEC, Bangkok | Isodynamique | |
UK Semiconductors 2024 | 08 - 09 July | UK | Sheffield | Sheffield Hallam University | Inseto | |
CPE2024 | 08 - 09 July | UK | Newcastele |
Civic Centre, Barras Bridge, Newcastle | Inseto |
|
EMAX | 24 - 26 July | Malaysia | Penang | SPICE Penang International Sports Arena, Penang | Isodynamique | |
SEMICON Taiwan |
04 - 06 September | Taiwan | Taipei | TaiNEX Hall 1 / Booth M1058 | Bondtronics | |
SEMICON India | 11 - 13 September | India | Dehli |
IEML, Greater Noida | GMS |
|
IMAPS |
01 - 02 October | USA | Boston | MA | Encore Boston Harbor Resort | Tresky Corp. |