Printed Circuit Board Assembly & PCB Design Forum
SMT electronics assembly manufacturing forum.
Views: 13588
We have started using QFN packages in large volume and are h...
- Nov 09, 2007
by
devajj
What is the real problem? No-solder can mean a variety of t...
- Nov 09, 2007
by
Hussman
Best I can tell (Factory is in Mexico) is no solder from pas...
- Nov 09, 2007
by
devajj
Hopefully this will help you. I happen to have a few similar...
- Nov 09, 2007
by
Mark M.
Hello, there are some questions first to be answered:
1. Wh...
- Nov 10, 2007
by
Mika
1. What is the body size? Who cares.
2. What is the pitch?...
- Nov 10, 2007
by
Real Chunks
Hi Real Chunks,
Nice to meet you.
Well, I certainly not ag...
- Nov 10, 2007
by
Mika
BTW, The surrounded QFN fine pitch terminals should have the...
- Nov 10, 2007
by
Mika
Chunks is right, reduce center pad by 50% print the signal p...
- Nov 12, 2007
by
RDR
> BTW, The surrounded QFN fine pitch terminals
> sho...
- Nov 12, 2007
by
devajj
You need to perform process a capability study prior to putt...
- Nov 12, 2007
by
RDR
recently, we also have problem with QFN around 3% defect rel...
- Nov 14, 2007
by
Reypal
Just to add to the subject, we experienced insufficient sold...
- Nov 15, 2007
by
Dback
So you are saying that 0.13 mm stencil thichknes and 20% red...
- Nov 16, 2007
by
Mika
We have found differing results based on the pattern used wh...
- Nov 19, 2007
by
Hegemon
BINGO! Now that's engineering!
...
- Nov 19, 2007
by
Real Chunks
I'm curious to know what the pitch of the outer pads is/was ...
- Jul 07, 2008
by
thughes
We used these same type of parameters regardless of the QFN ...
- Jul 11, 2008
by
Hegemon
Thanks!
...
- Jul 11, 2008
by
thughes