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Electronics Manufacturing Technical Articles

Electronics Manufacturing Technical Articles

Papers and articles related to SMT, PCB & EMS industry.


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1115 SMT / PCB Assembly Related Technical Articles

Fill the Void IV: Elimination of Inter-Via Voiding

Oct 10, 2019 | Tony Lentz - FCT Assembly, Greg Smith - BlueRing Stencils

Voids are a plague to our electronics and must be eliminated! Over the last few years we have studied voiding in solder joints and published three technical papers on methods to "Fill the Void." This paper is part four of this series. The focus of this work is to mitigate voids for via in pad circuit board designs.</p><p> Via holes in Quad Flat No-Lead (QFN) thermal pads create voiding issues. Gasses can come out of via holes and rise into the solder joint creating voids. Solder can also flow down into the via holes creating gaps in the solder joint. One method of preventing this is via plugging. Via holes can be plugged, capped, or left open. These via plugging options were compared and contrasted to each other with respect to voiding. Another method of minimizing voiding is through solder paste stencil design. Solder paste can be printed around the via holes with gas escape routes. This prevents gasses from via holes from being trapped in the solder joint. Several stencil designs were tested and voiding performance compared and contrasted.</p><p> In many cases voiding will be reduced only if a combination of mitigation strategies are used. Recommendations for combinations of via hole plugging and stencil design are given. The aim of this paper is to help the reader to "Fill the Void."...

Publisher: FCT ASSEMBLY, INC.

FCT ASSEMBLY, INC.

With numerous facilities in the United States, we are one of the electronics industry's leading manufacturers of lead-free solder products, superior quality stencils, and precision cut parts.

Greeley, Colorado, USA

Manufacturer of Assembly Material, Soldering

Power Interfaces

Oct 07, 2019 | ACI Technologies, Inc.

Power interfaces are required when external power sources like solar panels, fuel cells, or batteries are used to generate power for electrical devices. There are two major power interfaces commonly used, direct current to direct current (DC/DC) converters and direct current to alternating current (DC/AC) inverters. While both interfaces are designed to convert from variable DC inputs, they output to different power standards and power levels that are used in different applications....

Publisher: ACI Technologies, Inc.

ACI Technologies, Inc.

ACI, an authorized IPC Training Center operating the National Electronics Manufacturing Center of Excellence providing analytical testing, manufacturing and repair services to the electronics industry.

Philadelphia, Pennsylvania, USA

Design, IPC Standards Certification Center, Consultant, Service Provider, Training Provider

Effects of Temperature Uniformity on Package Warpage

Oct 03, 2019 | Neil Hubble, Charly Olson

Knowing how package warpage changes over temperature is a critical variable in order to assemble reliable surface mount attached technology. Component and component or component and board surfaces must stay relatively flat with one another or surface mount defects, such as head-in-pillow, open joints, bridged joints, stretched joints, etc. may occur. Initial package flatness can be affected by numerous aspects of the component manufacturing and design. However, change in shape over temperature is primarily driven by CTE mismatch between the different materials in the package. Thus material CTE is a critical factor in package design. When analyzing or modeling package warpage, one may assume that the package receives heat evenly on all sides, when in production this may not be the case. Thus, in order to understand how temperature uniformity can affect the warpage of a package, a case study of package warpage versus different heating spreads is performed.<p><p>Packages used in the case study have larger form factors, so that the effect of non-uniformity can be more readily quantified within each package. Small and thin packages are less prone to issues with package temperature variation, due to the ability for the heat to conduct through the package material and make up for uneven sources of heat. Multiple packages and multiple package form factors are measured for warpage via a shadow moiré technique while being heated and cooled through reflow profiles matching real world production conditions. Heating of the package is adjusted to compare an evenly heated package to one that is heated unevenly and has poor temperature uniformity between package surfaces. The warpage is measured dynamically as the package is heated and cooled. Conclusions are drawn as to how the role of uneven temperature spread affects the package warpage....

Publisher: Akrometrix

Akrometrix

Leading provider of full-field metrology solutions for substrates and packages in the OEM/CEM/SATS/PCB segments of the microelectronics industry.

Atlanta, Georgia, USA

OEM, Service Provider

Cleanliness/Corrosion Mitigation

Sep 27, 2019 | ACI Technologies, Inc.

One of the most critical factors in preventing corrosion from occurring in electronics is maintaining the state of cleanliness. This is not an easy feat to achieve. Corrosion is defined as the deterioration of a material or its properties due to a reaction of that material with its chemical environment. [1] So, to prevent corrosion from occurring, either the material or the chemical environment must be adjusted. Adjusting the material usually means application of a protective coating or replacing a more reactive material with a less reactive material. Adjusting the chemical environment usually means removing ionic species through cleaning, and removing moisture, usually with a conformal coating or hermetic package. Ionic species and moisture are problematic because they form an electrolyte which is able to conduct ions and electricity. Any metal that comes into contact with the electrolyte can begin to corrode....

Publisher: ACI Technologies, Inc.

ACI Technologies, Inc.

ACI, an authorized IPC Training Center operating the National Electronics Manufacturing Center of Excellence providing analytical testing, manufacturing and repair services to the electronics industry.

Philadelphia, Pennsylvania, USA

Design, IPC Standards Certification Center, Consultant, Service Provider, Training Provider

What is the main function of hot air dry oven?

Sep 25, 2019 | climatest symor

What is the main function of hot air dry oven? Drying ovens are devices used to remove moisture and other solvents from the items placed inside them through a forced convection process, collecting it elsewhere so that the object becomes dehydrated. A drying oven causes objects to dry out through evaporation. Drying ovens use convection heating,also called air forced, in which the object is heated through air currents. Water from the object escapes into the air, raising the humidity level and causing the semi-solid membranes inside the oven to absorb the water. The end result is that the oven removes water from the object being dried, leaving it dehydrated. Drying ovens contain a system for forcing convection currents to develop, usually either a fan or turbine, which aids in the heating and drying process by ensuring that the hot air circulates,many ovens are equipped with an adjustable ventilation system that allows the user to ensure that the system has an adequate air supply. For details,pls visit our website: https://climatechambers.com/articles&latestnews/what-is-the-main-function-of-hot-air-dry-oven.html...

Publisher: Symor Instrument Equipment Co.,Ltd

Symor Instrument Equipment Co.,Ltd

Climatest Symor® is the leading environmental simulation testing equipment manufacturer in China established in 2001, located at Dayang Industrial Park,Hefei,China.

Hefei, China

Manufacturer of Test Equipment

Thermal Capabilities of Solder Masks and Other Coating Materials - How High Can We Go?

Sep 24, 2019 | Sven Kramer

This paper focuses on three different coating material groups which were formulated to operate under high thermal stress and are applied at printed circuit board manufacturing level. While used for principally different applications, these coatings have in common that they can be key to a successful thermal management concept especially in e-mobility and lighting applications. The coatings consist of:</p><p> Specialty (green transparent) liquid photoimageable solder masks (LPiSM) compatible with long-term thermal storage/stress in excess of 150°C. Combined with the appropriate high-temperature base material, and along with a suitable copper pre-treatment, these solder resists are capable of fulfilling higher thermal demands. In this context, long-term storage tests as well as temperature cycling tests were conducted. Moreover, the effect of various Cu pre-treatment methods on the adhesion of the solder masks was examined following 150, 175 and 200°C ageing processes. For this purpose, test panels were conditioned for 2000 hours at the respective temperatures and were submitted to a cross-cut test every 500 h. Within this test set-up, it was found that a multi-level chemical pre-treatment gives significantly better adhesion results, in particular at 175°C and 200°C, compared with a pre-treatment by brush or pumice brush. Also, breakdown voltage as well as tracking resistance were investigated. For an application in LED technology, the light reflectivity and white colour stability of the printed circuit board are of major importance, especially when high-power LEDs are used which can generate larger amounts of heat. For this reason, a very high coverage power and an intense white colour with high reflectivity values are essential for white solder masks. These "ultra-white" and largely non-yellowing LPiSM need to be able to withstand specific thermal loads, especially in combination with high-power LED lighting applications.</p><p> The topic of thermal performance of coatings for electronics will also be discussed in view of printed heatsink paste (HSP) and thermal interface paste (TIP) coatings which are used for a growing number of applications. They are processed at the printed circuit board manufacturing level for thermal-coupling and heat-spreading purposes in various thermal management-sensitive fields, especially in the automotive and LED lighting industries. Besides giving an overview of the principle functionality, it will be discussed what makes these ceramic-filled epoxy- or silicone-based materials special compared to using "thermal greases" and "thermal pads" for heat dissipation purposes....

Publisher: Lackwerke Peters GmbH + Co KG

Lackwerke Peters GmbH + Co KG

Lackwerke Peters has progressively evolved into one of, if not the market leader for coating materials for assembled pcbs / flat packs in Europe, which includes renowned companies from aviation and aerospace technolog

Kempen, Germany

Manufacturer of Assembly Material

TDK Navitasys India X Ray case

Sep 23, 2019 | Joy Rong +8618779975930 info@seamarkxray.com

TDK Navitasys India X Ray case Navitasys India private Limited is belong to TDK Electronics AG (previously EPCOS AG) develops, manufactures and markets electronic components and systems under the product brands of TDK and EPCOS, focusing on fast-growing leading-edge technology markets, which include automotive electronics, industrial electronics and consumer electronics as well as information and communications technology.  China branch and India branch already purchased ZM X7800 X ray inspection machine in this year, At September 2019, Navitasys India private Limited factory get ready to Manufacture the Motorola electronics Products series, Seamark ZM sent engineer to India for install and train x ray inspection machine, For x ray series machine, Seamark ZM are working with the world-leading suppliers, including VJ technology(USA), Korea Rayence, Hamamatsu Photon(Japan), Teledyne Dalsa (USA) and iRay(China), Omron(Japan), Googoltech(China) etc. TDK Navitasys India X Ray case image It is great to know more and more companies are pay attention to products’ quality, Like TDK Electronics AG, There are many secrets to their success, and quality is one of them. Family of Industrial X-ray inspection machine & BGA rework station Last Article: Rashmi Rare Earth X Ray Machine Training Next Article:x ray inspect PCB and SMT patch module TSI Mexico use Seamark x ray machine Persang Alloy Industries X ray 6600 for PCB Maybe you still are interested in: Solder paste printing defects and solutions in SMT chip processing process Advantages of X-ray SMD counter ...

Publisher: Seamark zm Tech Group

Seamark zm Tech Group

Seamark ZM PCB BGA X-ray Inspection system Equipment -14 years experience in SMT field, Our experience will provide good solutions. X-Ray Inspection, BGA reworks tation,Full auto X ray SMD component machine

Shenzhen, China, China

Inspection

X ray parts counter Shipment

Sep 23, 2019 | Joy Rong +8618779975930 info@seamarkxray.com

X ray parts counter Shipment National Day (October 1) is coming, Seamark ZM needs to transport the machines out before the holiday, it is a busy week! 2019.9.23, we ship one set Online x ray smd parts counter to Taiwan, China for PCBA factory. Taiwan market have purchased a lot of x ray series from Seamark ZM. One set Offline x ray smd parts counter ship to Thailand for PCBA factory. Great tool for save money & Time!-X ray parts counter Shipment This equipment is mainly used for the rapid measurement of the reel type materials used in the SMT industry. It is based on the high industrial 4.0 standard, intelligent modular design, and can be used for 7-17 inch Tape Reel/JEDEC Tray/IC tide sensitive package. Piece, equipped with artificial intelligence deep learning software, cloud update system. Material types include all Resistance, capacitance, inductance, crystal, LED, diode, triode, multi-pin IC, etc...

Publisher: Seamark zm Tech Group

Seamark zm Tech Group

Seamark ZM PCB BGA X-ray Inspection system Equipment -14 years experience in SMT field, Our experience will provide good solutions. X-Ray Inspection, BGA reworks tation,Full auto X ray SMD component machine

Shenzhen, China, China

Inspection

Non-Destructive Test Methods

Sep 23, 2019 | ACI Technologies, Inc.

Failure analysis (FA), by its very nature, is needed only when things goawry. Before any testing is performed on the sample, a decision mustbe made as to whether or not the sample is allowed to be destroyedin the process of testing. Non-destructive testing can allow for re-use of the assembly since the functionality is not altered, but there still remains the possibility that inadvertent damage can occur through the course of the analysis. If non-destructive testing is preferred, then the following types of analysis can be performed. The testing can be divided into four categories: visual, X-ray (X-ray imaging and X-ray fluorescence), cleanliness (resistivity of solvent extract, ion chromatography, and Fourier transform infrared spectroscopy), and mechanical (non-destructive wire bond pull)....

Publisher: ACI Technologies, Inc.

ACI Technologies, Inc.

ACI, an authorized IPC Training Center operating the National Electronics Manufacturing Center of Excellence providing analytical testing, manufacturing and repair services to the electronics industry.

Philadelphia, Pennsylvania, USA

Design, IPC Standards Certification Center, Consultant, Service Provider, Training Provider

Seamark ZM EeIE 2019 SMT exhibition

Sep 19, 2019 | Joy Rong +8618779975930 info@seamarkxray.com

Seamark ZM EeIE 2019 Join US EeIE 2019 The EeIE 2019 exhibition which will be held at 4th–6th November, 2019, in Shenzhen. Seamark ZM will showcase the machines including semi-automated & fully-automated IR BGA rework system, 2D & 2.5D off-line x-ray inspection machine, and Online& offline x-ray parts counter. Seamark ZM EeIE 2019 Exhibition BGA rework system: Seamark zm started to develop and sell BGA rework station since 2004, Now we are No.1 In China, Seamark zm’ Aim:Quality is the first, customer experience first. Besides, Seamark ZM own the first one Full Automatic BGA rework station around the world, Full control by PC, that is why Seamark ZM can be Top One. X-ray parts counter: For Industry 4.0, the trend of SMT production line, and realize intelligent, less humanized and more efficient. Seamark ZM has always focused on the product itself. The x ray SMT counter has been developed to the 3rd generation. It has no deformation, no area difference, can be recognized by the naked eye, the point precision is 99.99%, and the material model coverage is wider. The speed of Counting reaches 5-12 seconds/reel. X-ray inspection machine: While technological accomplishments in the electronics industry are constantly growing, the components in the electronics industry are constantly shrinking. These components may be small in size, but when defects occur, the problems are big. Digital X-ray and Computed Tomography offer a window into this tiny world, delivering insight into root causes of product failure that can lead then to great product success. And Quality is the core, this is the meaning of the X ray inspection machine, quality is the core of the company, the product quality is good, the end customer is the ultimate beneficiary, X ray machine sale hot in these year, Nice to know more and more companies pay Attention to Quality. If you’d like to schedule a meeting with us at the EeIE 2019, 4th–6th November, 2019, Shenzhen International Convention and Exhibition Center ( Baoan ), Booth 3Q181. please contact our Seamark ZM Sales team– Email  info@seamarkxray.com, Whatstapp/Wechat/Tel: +8618779975930. Look forward to seeing you at EeIE 2019....

Publisher: Seamark zm Tech Group

Seamark zm Tech Group

Seamark ZM PCB BGA X-ray Inspection system Equipment -14 years experience in SMT field, Our experience will provide good solutions. X-Ray Inspection, BGA reworks tation,Full auto X ray SMD component machine

Shenzhen, China, China

Inspection

How Detrimental Production Concerns Related to Solder Mask Residues Can Be Countered by Simple Operational Adaptations

Sep 19, 2019 | Rick Nichols, Sandra Heinemann, Gustavo Ramos, Dr. Lars Nothdurft, Hubertus Mertens

The symbiotic relationship between solder masks and selective finishes is not new. The soldermask application is one of the key considerations to ensure a successful application of a selective finish. The selective finish is the final chemical step of the PCB manufacturing process, this is when the panels are at their most valuable and are unfortunately not re-workable. Imperfections are not tolerated, even if they are wholly cosmetic. Quality issues often manifest themselves in the form of a 'ping pong' conversation between the fabricators, the soldermask suppliers and the selective finish suppliers. Without tangible evidence these discussions are difficult to resolve and the selective finish process is usually regarded as responsible.</p> <p>This paper will focus on the chemical characteristics and use them to predict or identify potential issues before they occur rather than specifically name 'critical' soldermasks. It is also the intention of this paper to address the potential of a soldermask to react to common yield hiking practices like UV bumping and oven curing. It is hoped that this awareness will help fabricators to ensure maximum yields by asking the right questions. 'Critical’ soldermasks impact all selective finishes. In this paper, practical experience using immersion tin will be used to highlight the relationship between 'critical' soldermasks and some of the issues seen in the field. The paper will include a novel approach to identify re-deposited volatiles after the reflow....

Publisher: Atotech

Atotech

One of the world's leading suppliers of integrated production systems, chemistry, equipment, know-how and service for electroplating, semiconductor and printed circuit board manufacturing.

Berlin, Germany

Manufacturer of Assembly Material, Manufacturer of Components, Components/Substrates

Advantages of PET carrier tape

Sep 17, 2019 | James tong

1.PET carrier tape. It has outstanding mechanical function, and the impact strength is 3~5 times that of other films, and the folding resistance is good....

Publisher: Sewate Technology Co.,Ltd

Sewate Technology Co.,Ltd

Sewate professionally produce ESD protective packaging systems such as ic shipping tubes, plastic anti static ic tubes,, carrier tape, cover tape and reel for electronic component

Shenzhen, China

Antistatic, Component Packaging, Tape and Reel Services

Virtual Manufacturing

Sep 16, 2019 | ACI Technologies, Inc.

“What is Virtual Manufacturing?” The simplest answer is a manufacturing simulation using a computer. The more complete answer is that virtual manufacturing is the process of designing a model of a real system and conducting experiments with this model for the purpose of understanding the behavior of the system. In today’s complex manufacturing environment, processes must be completely understood before implementation in order to “get it right the first time.” To achieve this goal, the use of a virtual environment is essential for simulating individual manufacturing processes and the total manufacturing system. By driving compatibility between the product design and the assembly plant process, these virtual tools enable the early optimization of cost, quality, and time to help achieve integrated products, process and resource design, and affordability....

Publisher: ACI Technologies, Inc.

ACI Technologies, Inc.

ACI, an authorized IPC Training Center operating the National Electronics Manufacturing Center of Excellence providing analytical testing, manufacturing and repair services to the electronics industry.

Philadelphia, Pennsylvania, USA

Design, IPC Standards Certification Center, Consultant, Service Provider, Training Provider

X-Ray X-2000 Online SMD X-Ray Scanner点料机核心技术

Sep 15, 2019 | Joy Rong +8618779975930 info@seamarkxray.com

Online SMD X-Ray Scanner X-Ray X-2000 Online SMD X-Ray Scanner 点料机简介 本设备主要用于SMT行业生产用的卷盘类物料进行快速点数,以高度工业4.0为标准,智能模块化设计,可点7-17英寸Tape Reel/JEDEC Tray/IC潮敏包等全品项料件,配备人工智能深度学习软件,云端更新系统。 物料类型包括所有阻容类物料和IC类物料。利用X射线成像技术,对生产物料进行检测并获取图像信息,在通过SEAMARK公司自主研发的图像算法进行快速计数,即可获取物料的实际数量,同时可将物料数目按照类别分类统计,并将设备数据信息与客户MES系统对接。 X-Ray X-2000 Online SMD X-Ray Scanner点料机核心技术参数 整机设备尺寸: 3200mm*1300mm*2100mm 设备总重: 2.5t     电源电压: AC220V 50/60Hz    总功率: Max 2Kw 上料方式: 转盘式双工位自动感应上料(每个工位可缓存7-15寸盘50盘) 下料方式:转盘式双工位自动感应下料(每个工位可缓存7-15寸盘50盘) 异常物料存放区:前置试异常物料存放区(自动存放) X射线管 射线管品牌: 美国VJ        X光管电压: 80Kv X光管电流: 700uA                          焦点尺寸: 30um 探测器 品牌: 德国Iray                    成像面积: 427*427mm 像素尺寸:139um                              像素矩阵: 3072*3072pixels 灰阶: 16 bits                                      检测项目及尺寸 料盘最大尺寸: 17 inch 料盘最小尺寸: 7inch/包含更小的散料 料盘最大厚度: 85mm                      料盘最小厚度: 3mm 兼容最小期间类型 :01005               料盘覆盖率:持续更新数据库,可覆盖市面上99%的物料 其他规格 计数时间 约8~10秒/盘. 条码扫描 可配置一维、二维条码扫码枪, 标签打印 可实时打印物料编码、点数结果 计数精度 01005准确率>99.99%,0201准确率=100% 贴标方式:  CCD视觉识别料盘上旧条码坐标,将新的条码贴到料盘上并覆盖旧条码 检测元件 电阻、电容、电感、晶振、LED、二极管、三极管、多脚IC等 软件 支持任意格式SPC统计、图片和结果自动保存. 对接系统 ERP,MES等 辐射泄漏量 <1 μSv/Hour X-Ray X-2000 Online SMD X-Ray Scanner主要特点 优点1 基于全自动点料算法的深度学习 优点2 无需花费3-5天时间进行对厂内的料盘录入数据,用户可直接使用 优点3 累积点料数据库共享到所有机器 优点4 数据更多,点料更可靠,更精准 优点5 可点7~17inch寸料盘 优点6 支持随机位置,优秀的用户体验 优点7 算法/数据库永久更新和支持 优点8 基于深度学习的极高可靠性和可重复性 为什么我们做的更好 ? 其他公司 深圳卓茂 需要用户做大量的工作,基于用户的能力来 使用云/人工智能来把图像资料集中起来,基于专家和深度学习来点料 条形码作为算法和元器件的链接而存 使用人工智能来识别元器件,并自动应用于算法中 无法把点料数据集中起来,算法无法共享  使用人工智能来识别元器件,并自动应用于算法中 无法把点料数据集中起来,算法无法共享  使用集中的数据库,共享所有点料算法/信息给每一个用户 X-RAY点料机实测结果 序列     类别       料盘大小    数量         准确率         循环时间 (seconds)) 1     01005          7″     20000PCS     99.98%        6s~18s 2       0201          7″       10000PCS      100%          10s~13s 3       0402           7″      10000PCS      100%          10s~13s 4      0603          7″       5000PCS      100%          10s~13s 5       0402          15″      50000PCS      100%          10s~13s 6       10×10        15″       500PCS       100%          10s~13s 备注:根据物料数量多与少的情况,时间效率会有轻微变化,此点数效率根据后续云端数据库或定期软件数据库的更新,还会有所提高。 X-RAY点料机云存储介绍 设备属于智能云端控制,每一台设备每天所点的料盘图片会通过联网自动将图片存储到云端数据库,工程师们会在后台将这些图片优化,再将优化好的各种料盘的数据每个月更新到数据库,以便提高料盘点数准确率。时间越久,料盘准确率就会更高,直至100%。(如果客户不愿意联网更新数据库,我们可以提供U盘离线更新数据库) 客户购买我们机器后,我们日积月累已经收集和整理了非常大的数据库,存储在云端或软件里。当客户所使用的元器件存在于数据库内时,便可以直接进行点料,无需再建立此料盘的数据,效率更高,准确率也更高。 为什么要使用X-RAY点料机 ? 测试参数    傳統點料機                X -RAY 点料机X-2000 每班人數                 6人                          1人 每盤料時間            80秒                        12秒 每班總數              1800盤                     1920盤 1、无须拆开包装袋,保持料卷完整性,不会影响料件防潮性。 2、大幅降低清点时间,免去多余人力,可转而协助其他人员收线或换线,缩短换线停线时间。 3、智慧点料机采用数位化资料,可列印条码贴纸或是直接上传资料库。而传统方式的点料仪器,必须每位操作人员一台,占用空间大,清点结果还是人工填写,有可能写错或漏写。 4、智慧点料机可大幅度改善缺料、丢料、漏料、少料情况,数位化管理物料仓储,降低物料库存成本,提高物料盘点准确性。 5、迎接工业4.0,SMT生产线的趋势,智慧化、少人化、效率化。 支持一下料盘点料:高级图像打散算法-处理相连(高)的芯片, 处理相连(高)的芯片, 满料盘自动点料(防潮袋 ),   (自动)可点散落芯片, 精准点算重叠相连的芯片, (自动)全球首创空料盘检测技术。 Family of Industrial X-ray inspection machine & BGA rework station Last Article: Method for detecting electronic components quickly Next Article:x ray inspect PCB and SMT patch module TSI Mexico use Seamark x ray machine Persang Alloy Industries X ray 6600 for PCB Maybe you still are interested in: Solder paste printing defects and solutions in SMT chip processing process Advantages of X-ray SMD counter ...

Publisher: Seamark zm Tech Group

Seamark zm Tech Group

Seamark ZM PCB BGA X-ray Inspection system Equipment -14 years experience in SMT field, Our experience will provide good solutions. X-Ray Inspection, BGA reworks tation,Full auto X ray SMD component machine

Shenzhen, China, China

Inspection

Online SMD Component Counters Scanner

Sep 15, 2019 | Joy Rong +8618779975930 info@seamarkxray.com

Online SMD Component Counters Scanner X-Ray X-2000 Online SMD Component Counters Scanner Introduction This equipment is mainly used for the rapid measurement of the reel type materials used in the SMT industry. It is based on the high industrial 4.0 standard, intelligent modular design, and can be used for 7-17 inch Tape Reel/JEDEC Tray/IC tide sensitive package. Piece, equipped with artificial intelligence deep learning software, cloud update system. Material types include all Resistance, capacitance, inductance, crystal, LED, diode, triode, multi-pin IC, etc. X-ray imaging technology is used to detect the production materials and obtain image information. The image is automatically counted by SEAMARK’s self-developed image algorithm to obtain the actual quantity of materials, and the number of materials can be classified according to categories and equipment. The data information is interfaced with the customer MES system. Online SMD Component Counters Scanner Technical Parameters Dimension: 3200mm*1300mm*2100mm Weight: 2.5t    Voltage: AC220V 50/60Hz    Power: Max 2Kw Loading method: Rotary type double station automatic induction loading (each station can cache 50 disks of 7-15 inch disk) Unloading method:Rotary type double station automatic induction unloading (each station can cache 50 disks of 7-15 inch disk) Abnormal material storage area: pre-test abnormal material storage area (automatic storage) X ray tube brand: United States VJ        X ray tube voltage: 80Kv X ray tube Max tube current: 700uA     Focal spot size: 30um FPD Brand: Germany Iray                       Detector Imaging area: 427*427mm Pixel size:139um                                         Pixel matrix: 3072*3072pixels Gray scale: 16 bits                                      Reel Inspection size range: 7- 17 inch (Contains smaller bulk material ) Reel Inspection thickness: 3-85mm      Min parts size :01005 Tray Coverage: Continuously update the database to cover 99% of the material on the market Counting time: About 8~10s/reel. Barcode scanning Configurable 1D, 2D barcode scanning code gun, label printing Real-time printing of material code, point results Counting accuracy 01005 accuracy rate >99.99%, 0201 accuracy rate =100% Label printing: CCD visually identifies the old bar code coordinates on the tray, and pastes the new bar code onto the tray and overwrites the old bar code Parts support: Resistance, capacitance, inductance, crystal, LED, diode, triode, multi-pin IC, etc. Software: Support for automatic saving of SPC statistics, images and results in any format System docking: ERP, MES, etc. Radiation<1 μSv/Hour X-Ray X-2000 Online SMD Component Counters Scanner Main feature Advantage 1: Deep learning based on fully automatic counting algorithm Advantage 2: It does not take 3-5 days to enter data into the in-plant tray, which can be used directly. Advantage 3: Cumulative counting database sharing to all machines Advantage 4: More data, more reliable and more accurate Advantage 5: Can support 7~17inch tray Advantage 6: Support random location, excellent user experience Advantage 7: Algorithm/database permanent update and support Advantage 8: Extremely high reliability and repeatability based on deep learning Why are Seamark ZM doing better?                       Other Brands  Seamark zm Do a lot of work, based on the user’s ability to count  Use cloud/artificial intelligence to get together image data, based on experts & deep learning to count Barcodes exist as links to algorithms and components Use artificial intelligence to identify components and automatically apply them to algorithms Unable to collect data, algorithms can’t share Share all counting algorithms/information to each user using a centralized database X-RAY Online SMD Component Counters Scanner results of testing No.    Parts    Reel size        Qty       Accuracy      Speed (s) 1      01005    7″          20000PCS     99.98%       16s~18s 2      0201      7″           10000PCS     100%         10s~13s 3     0402        7″           10000PCS     100%         10s~13s 4     0603      7″            5000PCS      100%        10s~13s 5    0402        15″           50000PCS     100%        10s~13s 6    10×10       15″           500PCS        100%       10s~13s Remarks: According to the quantity of materials, the time efficiency will change slightly. The efficiency of this X-ray smd counter will be improved according to the update of the subsequent cloud database or regular software database. X-RAY Cloud storage introduction The device is controlled by the intelligent cloud. Each device’s tray image will be automatically stored in the cloud database through the network. Engineers will optimize these images in the background, and then optimize the data of each tray. Updated to the database in a month to increase the accuracy of the tray points. The longer the time, the higher the accuracy of the tray, up to 100%. (If the customer is not willing to update the database online, we can provide a USB flash drive offline update database) he device has collected and organized a very large database, stored in the cloud or in software. When the components used by the customer exist in the database, the material can be directly processed, and the data of the tray is not required to be built, and the efficiency is higher and the accuracy is higher. Why use an Auto Online Counters, not Traditional Manual SMD counter? Traditional Manual SMD counter       Auto Online Counters Worker quantity        6worker                           1 worker Reel counting time    80s                           12s Reel counting quantity       1800 reel                     1920 reel 1、Automatic x-ray SMD counter, which eliminates the need to unpack the bag and maintain the integrity of the roll without affecting the moisture resistance of the material. 2、Automatic x-ray SMD counter greatly reduces the inventory time, eliminating the need for extra manpower, and can assist other people to take over or change lines, shortening the time for line change. 3、Automatic x-ray SMD counter uses digital data to print barcode stickers or upload directly to the database. The traditional Manual SMD counter must have one operator per user, occupying a large space, and the result of the inventory is manually filled in, and it is possible to write a wrong or missed write. 4、Automatic x-ray SMD counter can greatly improve the shortage of material, material loss, material leakage, and material shortage, digitally manage material storage, reduce material inventory cost, and improve material inventory accuracy. 5、For Industry 4.0, the trend of SMT production line, and realize intelligent, less humanized and more efficient. Support the following tray materials: advanced image scattering algorithm – processing connected (high) chips, processing connected (high) chips, automatic feeding of full trays (moisture-proof bags), (automatic) point-distributing chips, accurate counting Overlapping chips, (automatic) the world’s first empty tray detection technology. Family of Industrial X-ray inspection machine & BGA rework station Last Article: Method for detecting electronic components quickly Next Article:x ray inspect PCB and SMT patch module TSI Mexico use Seamark x ray machine Persang Alloy Industries X ray 6600 for PCB Maybe you still are interested in: Solder paste printing defects and solutions in SMT chip processing process Advantages of X-ray SMD counter ...

Publisher: Seamark zm Tech Group

Seamark zm Tech Group

Seamark ZM PCB BGA X-ray Inspection system Equipment -14 years experience in SMT field, Our experience will provide good solutions. X-Ray Inspection, BGA reworks tation,Full auto X ray SMD component machine

Shenzhen, China, China

Inspection

Manual parts Counter & Auto parts counter

Sep 15, 2019 | Joy Rong +8618779975930 info@seamarkxray.com

Manual parts Counter & Auto parts counter Manual parts Counter & Auto parts counter Foxconn purchased Auto x ray parts counter for replace 6-7 workers to counting smd reels tray, no need to open the sealed package&take out mositure barrier bag, good choice for high sensitive components counting. By the way, the machine is Integrated to all major ERP/MES systems, it achieves full automation and intelligence in the SMT  industry. Photo 1 shows Manual parts Counter & Auto parts counter Fast return of invest (ROI)-Manual parts Counter & Auto parts counter ROI No# Item  Content Traditional Parts Counter Seamark Auto Parts counter 1 Counting Counting Time/Reel(S) 80 15 2 Input result into system time (S) 12–15 NO 3  Total Time/Reel 95s 15s 4 Total reels/Day/Person 300 1920 5 WorkLoad /Day Reels need to count/Day                       2000 6 Workers need 5-6 1 7 Cost Salary of workers/Month/Person  USD800 USD700 8 Total salary/Year USD57600 USD8400 9 Manpower saved/Year USD49200 10 Result Around 14-18 months can get back the investment Remark:.Worker salary is based on Chinese salary level in 2018. You can get more accurate result on your local salary level. Photo 2 shows Huge workload is easy for Auto x ray parts counter Many thanks for Foxconn’ great support, Foxconn are using Seamark ZM ‘Industrial X-ray Inspection Equipment & BGA Rework Station & X-ray SMD parts counter machine, how about you? Following Foxconn Please, and do better! Family of Online SMD Component Counters Scanner Last Article: Method for detecting electronic components quickly Next Article: Online SMD X-Ray Scanner TSI Mexico use Seamark x ray machine Persang Alloy Industries X ray 6600 for PCB Maybe you still are interested in: Solder paste printing defects and solutions in SMT chip processing process Advantages of X-ray SMD counter ...

Publisher: Seamark zm Tech Group

Seamark zm Tech Group

Seamark ZM PCB BGA X-ray Inspection system Equipment -14 years experience in SMT field, Our experience will provide good solutions. X-Ray Inspection, BGA reworks tation,Full auto X ray SMD component machine

Shenzhen, China, China

Inspection

Rashmi Rare Earth X Ray Machine Training

Sep 15, 2019 | Joy Rong +8618779975930 info@seamarkxray.com

Rashmi Rare Earth X Ray Machine Training Rashmi Rare Earth Limited is an electronic manufacturing services (EMS) company & Electronic Contract Manufacturing of PCBA & mobile Assembling company, based out of Noida, Uttarpardesh. It is start from January 2019. Rashmi Rare Earth Limited specializes in manufacturing mobile phones and electronic mobile accessories such as charger and batteries. It offering world class PCBA and Mobile Cell Phone Assembly. With a proven excellence in providing the quality manufacturing, assembling and PCBA manufacturing, They purchased SPI AOI, and x ray inspection machine for PCB BGA quality inspection, with high end infrastructure facilitates clean room. Rashmi Rare Earth X Ray Machine Training In Septemper 2019, Our Company send Engineer to Rashmi Rare Earth for training the x ray machine X6600 and BGA rework station ZM R6200 ( ZM R6200 have upgrade to ZM R7220A ), With X Ray machine’ help, they can find out the Root cause and improve it, save manpower and repair cost. Rashmi Rare Earth X Ray Machine Training Photo If more company like Rashmi Rare Earth pay more attention to Quality, India electronic manufacturing services (EMS ) market will get more and more better. Family of Online SMD Component Counters Scanner Last Article: Method for detecting electronic components quickly Next Article: Online SMD X-Ray Scanner TSI Mexico use Seamark x ray machine Persang Alloy Industries X ray 6600 for PCB Maybe you still are interested in: Solder paste printing defects and solutions in SMT chip processing process Advantages of X-ray SMD counter ...

Publisher: Seamark zm Tech Group

Seamark zm Tech Group

Seamark ZM PCB BGA X-ray Inspection system Equipment -14 years experience in SMT field, Our experience will provide good solutions. X-Ray Inspection, BGA reworks tation,Full auto X ray SMD component machine

Shenzhen, China, China

Inspection

Investigation of Cutting Quality and Mitigation Methods for Laser Depaneling of Printed Circuit Boards

Sep 11, 2019 | Ahne Oosterhof, Eastwood Consulting, Javier Gonzalez, LPKF Laser & Electronics AG

There are numerous techniques to singulate printed circuit boards after assembly including break-out, routing, wheel cutting and now laser cutting. Lasers have several desirable advantages such as very narrow kerf widths as well as virtually no dust, no mechanical stress, visual pattern recognition and fast set-up changes. The very narrow kerf width resulting from laser ablation and the very tight tolerance of the cutting path placement allows for more usable space on the panel. However, the energy used in the laser cutting process can also create unwanted products on the cut walls as a result of the direct laser ablation. The question raised often is: What are these products, and how far can the creation of such products be mitigated through variation of the laser cutting process, laser parameters and material handling? This paper discusses the type and quantity of the products found on sidewalls of laser depaneled circuit boards and it quantifies the results through measurements of breakdown voltage, as well as electrical impedance. Further this paper discusses mitigation strategies to prevent or limit the amount of change in surface quality as a result of the laser cutting process. Depending on the final application of the circuit board it may prompt a need for proper specification of the expected results in terms of cut surface quality. This in turn will impact the placement of runs and components during layout. It will assist designers and engineers in defining these parameters sufficiently in order to have a predictable quality of the circuit boards after depaneling....

Publisher: LPKF Laser & Electronics

LPKF Laser & Electronics

With its broad product range LPKF is one of the world market leaders in the "in-house rapid PCB prototyping" and "StencilLaser" services

Tualatin, Oregon, USA

Manufacturer of Assembly Equipment, Drilling/Routing

Full Material Declarations: Removing Barriers to Environmental Data Reporting

Sep 04, 2019 | Roger L. Franz

Since the European Directives, RoHS (Restriction of Hazardous Substances) and REACH (Registration, Evaluation, Authorization and Restriction of Chemicals), entered into force in 2006-7, the number of regulated substances continues to grow. REACH adds new substances roughly twice a year, and more substances will be added to RoHS in 2019. While these open-ended regulations represent an ongoing burden for supply chain reporting, some ability to remain ahead of new substance restrictions can be achieved through full material declarations (FMD) specifically the IPC-1752A Class D Standard (the "Standard"), which was developed by the IPC - Association Connecting Electronic Industries. What is important to the supply chain is access to user-friendly, easily accessible or free, fully supported tools that allow suppliers to create and modify XML (Extensible Markup Language) files as specified in the Standard. Some tools will provide enhancements that validate required data entry and provide real-time interactive messages to facilitate the resolution of errors. In addition, validation and auto-population of substance CAS (Chemical Abstract Service) numbers, and Class D weight rollup validation ensure greater success in the acceptance of the declarations in customer systems that automate data gathering and reporting. A good tool should support importing existing IPC-1752A files for editing; this capability reduces the effort to update older declarations and greatly benefits suppliers of a family of products with similar composition. One of the problems with FMDs is the use of "wildcard" non-CAS numbers based on a declarable substance list (DSL). While the substances in different company's lists tend to have some overlap, no two DSL’s are the same. We provide an understanding of the commonality and differences between representative DSLs, and the ability to configure how much of a non-DSL substance percent is allowed. Case studies are discussed to show how supplier compliance data, can be automatically loaded into the customer's enterprise compliance system. Finally, we briefly discuss future enhancements and other developments like Once an Article, Always an Article (O5A) that will continue to require IPC standards and supporting tools to evolve....

Publisher: TE Connectivity

TE Connectivity

A technology leader in the world's fastest growing markets, helping connect power, data and signal in everything from automotive and aerospace to broadband communications, consumer, energy and industrial applications.

Schaffhausen, Switzerland

Manufacturer of Components, IPC Standards Certification Center, Training Provider

Microscopy in Failure Analysis

Sep 03, 2019 | ACI Technologies, Inc.

Both optical and scanning electron microscopy (SEM) are powerful tools for failure analysis in electronics and are used for low and high magnification examination. This article will provide detailed, step by step information for examining solder joints....

Publisher: ACI Technologies, Inc.

ACI Technologies, Inc.

ACI, an authorized IPC Training Center operating the National Electronics Manufacturing Center of Excellence providing analytical testing, manufacturing and repair services to the electronics industry.

Philadelphia, Pennsylvania, USA

Design, IPC Standards Certification Center, Consultant, Service Provider, Training Provider

What is the difference between the carrier tape and the cover tape?

Sep 03, 2019 | James tong

The cover tape and the carrier tape are two different products, and many people cannot distinguish the difference between the cover tape and the carrier tape....

Publisher: Sewate Technology Co.,Ltd

Sewate Technology Co.,Ltd

Sewate professionally produce ESD protective packaging systems such as ic shipping tubes, plastic anti static ic tubes,, carrier tape, cover tape and reel for electronic component

Shenzhen, China

Antistatic, Component Packaging, Tape and Reel Services

Graphene electronic fibres with touch-sensing and light emitting functionalities for smart textiles

Aug 29, 2019 | Elias Torres Alonso, Daniela P. Rodrigues, Mukond Khetani, Dong-Wook Shin, Adolfo De Sanctis, Hugo Joulie, Isabel de Schrijver, Anna Baldycheva, Helena Alves, Ana I. S. Neves, Saverio Russo, Monica F. Craciun

The true integration of electronics into textiles requires the fabrication of devices directly on the fibre itself using high-performance materials that allow seamless incorporation into fabrics. Woven electronics and opto-electronics, attained by intertwined fibres with complementary functions are the emerging and most ambitious technological and scientific frontier. Here we demonstrate graphene-enabled functional devices directly fabricated on textile fibres and attained by weaving graphene electronic fibres in a fabric. Capacitive touch-sensors and light-emitting devices were produced using a roll-to-roll-compatible patterning technique, opening new avenues for woven textile electronics. Finally, the demonstration of fabric-enabled pixels for displays and position sensitive functions is a gateway for novel electronic skin, wearable electronic and smart textile applications....

Publisher: University of Exeter, College of Engineering, Mathematics and Physical Sciences

University of Exeter, College of Engineering, Mathematics and Physical Sciences

The College of Engineering, Mathematics and Physical Sciences comprises seven unique subject areas: Computer Science, Engineering, Geology, Mathematics, Mining and Minerals Engineering, Physics and Astronomy and Renewable Energy.

Exeter, United Kingdom

School

What are the factors that affect the appearance of IC shipping tubes?

Aug 24, 2019 | James tong

Many customers looking for IC shipping tubes value the appearance of the packing tube. They will feel that if the appearance of the IC tube does not look good, the quality will not be very good, so the first impression of the appearance of the Antistatic ic tube is very important. So what are the factors that affect the appearance of IC tubes?...

Publisher: Sewate Technology Co.,Ltd

Sewate Technology Co.,Ltd

Sewate professionally produce ESD protective packaging systems such as ic shipping tubes, plastic anti static ic tubes,, carrier tape, cover tape and reel for electronic component

Shenzhen, China

Antistatic, Component Packaging, Tape and Reel Services

What is usage of Electronic dry cabinet?

Aug 19, 2019 | climatest symor

Electronic dry cabinet for MSD storage Humidity is one of the key reasons for rejected products, many manufacturers are taking measures to control the humidity to increase production efficiency and save cost. In semiconductor and electronic industry, the key section of rejected products mostly happen during SMT heating process, Climatest Symor® auto dry cabinet is a superior solution to avoid the cracking. Warranty: two years with lifetime technical support...

Publisher: Symor Instrument Equipment Co.,Ltd

Symor Instrument Equipment Co.,Ltd

Climatest Symor® is the leading environmental simulation testing equipment manufacturer in China established in 2001, located at Dayang Industrial Park,Hefei,China.

Hefei, China

Manufacturer of Test Equipment

Automated Testing with Boundary Scan

Aug 19, 2019 | ACI Technologies, Inc.

Boundary scan is a method for testing interconnects on printed circuit boards (PCBs) or sub-blocks inside an integrated circuit. It has rapidly become the technology of choice for building reliable high technology electronic products with a high degree of testability. Due to the low-cost and integrated circuit (IC) level access capabilities of boundary scan, its use has expanded beyond traditional board test applications into product design and service....

Publisher: ACI Technologies, Inc.

ACI Technologies, Inc.

ACI, an authorized IPC Training Center operating the National Electronics Manufacturing Center of Excellence providing analytical testing, manufacturing and repair services to the electronics industry.

Philadelphia, Pennsylvania, USA

Design, IPC Standards Certification Center, Consultant, Service Provider, Training Provider

Cracks: The Hidden Defect

Aug 15, 2019 | John Maxwell

Cracks in ceramic chip capacitors can be introduced at any process step during surface mount assembly. Thermal shock has become a "pat" answer for all of these cracks, but about 75 to 80% originate from other sources. These sources include pick and place machine centering jaws, vacuum pick up bit, board depanelization, unwarping boards after soldering, test fixtures, connector insulation, final assembly, as well as defective components. Each source has a unique signature in the type of crack that it develops so that each can be identified as the source of error....

Publisher: AVX Corporation

AVX Corporation

A leading international electronic supplier of components and connectors with worldwide manufacturing facilities, offering the world's broadest selection of passive electronic components.

Fountain Inn, South Carolina, USA

Cleaning Flux Residue under Leadless Components using Objective Evidence to Determine Cleaning Performance

Aug 14, 2019 | Mike Bixenman - KYZEN Corporation, Vladimir Sitko, Pavel Hub - PBT Works

Cleanliness is a product of design, including component density, standoff height and the cleaning equipment’s ability to deliver the cleaning agent to the source of residue. The presence of manufacturing process soil, such as flux residue, incompletely activated flux, incompletely cured solder masks, debris from handling and processing fixtures, and incomplete removal of cleaning fluids can hinder the functional lifetime of the product. Contaminates trapped under a component are more problematic to failure. Advanced test methods are needed to obtain "objective evidence" for removing flux residues under leadless components.</p><p>Cleaning process performance is a function of cleaning capacity and defined cleanliness. Cleaning performance can be influenced by the PCB design, cleaning material, cleaning machine, reflow conditions and a wide range of process parameters.</p><p>This research project is designed to study visual flux residues trapped under the bottom termination of leadless components. This paper will research a non-destructive visual method that can be used to study the cleanability of solder pastes, cleaning material effectiveness for the soil, cleaning machine effectiveness and process parameters needed to render a clean part....

Publisher: KYZEN Corporation

KYZEN Corporation

A leading supplier of precision cleaning chemistries to the worldwide electronics, metal finishing, medical, semiconductor, and optical industries.

Nashville, Tennessee, USA

Cleaning

How to deal with the carrier tape and the cover tape sealing crack

Aug 14, 2019 | James tong

There are five forms of carrier tape sealing cracking. In particular, it is more important to seal products such as IC components (IC tape carriers) and lighter and thinner LED components (LED tape carriers). ...

Publisher: Sewate Technology Co.,Ltd

Sewate Technology Co.,Ltd

Sewate professionally produce ESD protective packaging systems such as ic shipping tubes, plastic anti static ic tubes,, carrier tape, cover tape and reel for electronic component

Shenzhen, China

Antistatic, Component Packaging, Tape and Reel Services

How to select the best SCADA training

Aug 09, 2019 | Don Fitchett

Working with SCADA systems when not properly trained and qualified can be almost as dangerous as working with PLCs without proper PLC training. Some times it can be even more costly to a company. This article explains the best way to learn SCADA systems, also the most cost-effective way! Read to learn how to select the best, what to look for in a SCADA course....

Publisher: Business Industrial Network

Business Industrial Network

Offers training software and videos. Also on site training and seminars that qualify for CEUs to maintenance, engineering and management professionals.

Las Vegas, Nevada, USA

Consultant, Publication or Online Resource, Service Provider, Software Manufacturer, Training Provider

Selective Soldering and the Modular Approach

Aug 08, 2019 | ACI Technologies, Inc.

High mix production is the mainstay of many electronics assembly plants. Lot sizes and board complexities vary and the boards are often mixed technology, comprising a blend of both surface mount and through-hole technology. Modularizing a production line enables a clear distinction between one type of assembly process and another. This article assumes a modern factory where a job can be routed to the selective soldering machine module, the hand assembly bench, or a combination of both. The decision rules of routing a circuit board through hand assembly versus automated selective soldering are discussed. Hand assembly soldering operations require no explanation....

Publisher: ACI Technologies, Inc.

ACI Technologies, Inc.

ACI, an authorized IPC Training Center operating the National Electronics Manufacturing Center of Excellence providing analytical testing, manufacturing and repair services to the electronics industry.

Philadelphia, Pennsylvania, USA

Design, IPC Standards Certification Center, Consultant, Service Provider, Training Provider

Novel Approach to Void Reduction Using Microflux Coated Solder Preforms for QFN/BTC Packages that Generate Heat

Aug 07, 2019 | Anna Lifton, Paul Salerno, Jerry Sidone, Oskar Khasalev

The requirement to reconsider traditional soldering methods is becoming more relevant as the demand for bottom terminated components (QFN/BTC) increases. Thermal pads under said components are designed to enhance the thermal and electrical performance of the component and ultimately allow the component to run more efficiently. Additionally, low voiding is important in decreasing the current path of the circuit to maximize high speed and RF performances. The demand to develop smaller, more reliable, packages has seen voiding requirements decrease below 15 percent and in some instances, below 10 percent.</p><p>Earlier work has demonstrated the use of micro-fluxed solder preforms as a mechanism to reduce voiding. The current work builds upon these results to focus on developing an engineered approach to void reduction in leadless components (QFN) through increasing understanding of how processing parameters and a use of custom designed micro-fluxed preforms interact. Leveraging the use of a micro-fluxed solder preform in conjunction with low voiding solder paste, stencil design, and application knowhow are critical factors in determining voiding in QFN packages. The study presented seeks to understand the vectors that can contribute to voiding such as PCB pad finish, reflow profile, reflow atmosphere, via configuration, and ultimately solder design.</p><p>A collaboration between three companies consisting of solder materials supplier, a power semiconductor supplier, and an electronic assembly manufacturer worked together for an in-depth study into the effectiveness of solder preforms at reducing voiding under some of the most prevalent bottom terminated components packages. The effects of factors such as thermal pad size, finish on PCB, preform types, stencil design, reflow profile and atmosphere, have been evaluated using lead-free SAC305 low voiding solder paste and micro-fluxed preforms. Design and manufacturing rules developed from this work will be discussed....

Publisher: Alpha Assembly Solutions

Alpha Assembly Solutions

Alpha Assembly Solutions is a world leader in the development, manufacturing, and sales of innovative materials used in the assembly electronics, industrial joining and Photo Voltaic market places.

South Plainfield, New Jersey, USA

Manufacturer of Assembly Material

Online SMD Component Counters Scanner

Aug 07, 2019 | Joy Rong +8618779975930 info@seamarkxray.com

Online SMD Component Counters Scanner X-Ray X-2000 Online SMD Component Counters Scanner Introduction This equipment is mainly used for the rapid measurement of the reel type materials used in the SMT industry. It is based on the high industrial 4.0 standard, intelligent modular design, and can be used for 7-17 inch Tape Reel/JEDEC Tray/IC tide sensitive package. Piece, equipped with artificial intelligence deep learning software, cloud update system. Material types include all Resistance, capacitance, inductance, crystal, LED, diode, triode, multi-pin IC, etc. X-ray imaging technology is used to detect the production materials and obtain image information. The image is automatically counted by SEAMARK’s self-developed image algorithm to obtain the actual quantity of materials, and the number of materials can be classified according to categories and equipment. The data information is interfaced with the customer MES system. Online SMD Component Counters Scanner Technical Parameters Dimension: 3200mm*1300mm*2100mm Weight: 2.5t    Voltage: AC220V 50/60Hz    Power: Max 2Kw Loading method: Rotary type double station automatic induction loading (each station can cache 50 disks of 7-15 inch disk) Unloading method:Rotary type double station automatic induction unloading (each station can cache 50 disks of 7-15 inch disk) Abnormal material storage area: pre-test abnormal material storage area (automatic storage) X ray tube brand: United States VJ        X ray tube voltage: 80Kv X ray tube Max tube current: 700uA     Focal spot size: 30um FPD Brand: Germany Iray                       Detector Imaging area: 427*427mm Pixel size:139um                                         Pixel matrix: 3072*3072pixels Gray scale: 16 bits                                      Reel Inspection size range: 7- 17 inch (Contains smaller bulk material ) Reel Inspection thickness: 3-85mm      Min parts size :01005 Tray Coverage: Continuously update the database to cover 99% of the material on the market Counting time: About 8~10s/reel. Barcode scanning Configurable 1D, 2D barcode scanning code gun, label printing Real-time printing of material code, point results Counting accuracy 01005 accuracy rate >99.99%, 0201 accuracy rate =100% Label printing: CCD visually identifies the old bar code coordinates on the tray, and pastes the new bar code onto the tray and overwrites the old bar code Parts support: Resistance, capacitance, inductance, crystal, LED, diode, triode, multi-pin IC, etc. Software: Support for automatic saving of SPC statistics, images and results in any format System docking: ERP, MES, etc. Radiation<1 μSv/Hour X-Ray X-2000 Online SMD Component Counters Scanner Main feature Advantage 1: Deep learning based on fully automatic counting algorithm Advantage 2: It does not take 3-5 days to enter data into the in-plant tray, which can be used directly. Advantage 3: Cumulative counting database sharing to all machines Advantage 4: More data, more reliable and more accurate Advantage 5: Can support 7~17inch tray Advantage 6: Support random location, excellent user experience Advantage 7: Algorithm/database permanent update and support Advantage 8: Extremely high reliability and repeatability based on deep learning Why are Seamark ZM doing better?                       Other Brands  Seamark zm Do a lot of work, based on the user’s ability to count  Use cloud/artificial intelligence to get together image data, based on experts & deep learning to count Barcodes exist as links to algorithms and components Use artificial intelligence to identify components and automatically apply them to algorithms Unable to collect data, algorithms can’t share Share all counting algorithms/information to each user using a centralized database X-RAY Online SMD Component Counters Scanner results of testing No.    Parts    Reel size        Qty       Accuracy      Speed (s) 1      01005    7″          20000PCS     99.98%       16s~18s 2      0201      7″           10000PCS     100%         10s~13s 3     0402        7″           10000PCS     100%         10s~13s 4     0603      7″            5000PCS      100%        10s~13s 5    0402        15″           50000PCS     100%        10s~13s 6    10×10       15″           500PCS        100%       10s~13s Remarks: According to the quantity of materials, the time efficiency will change slightly. The efficiency of this X-ray smd counter will be improved according to the update of the subsequent cloud database or regular software database. X-RAY Cloud storage introduction The device is controlled by the intelligent cloud. Each device’s tray image will be automatically stored in the cloud database through the network. Engineers will optimize these images in the background, and then optimize the data of each tray. Updated to the database in a month to increase the accuracy of the tray points. The longer the time, the higher the accuracy of the tray, up to 100%. (If the customer is not willing to update the database online, we can provide a USB flash drive offline update database) he device has collected and organized a very large database, stored in the cloud or in software. When the components used by the customer exist in the database, the material can be directly processed, and the data of the tray is not required to be built, and the efficiency is higher and the accuracy is higher. Why use an Auto Online Counters, not Traditional Manual SMD counter? Traditional Manual SMD counter       Auto Online Counters Worker quantity        6worker                           1 worker Reel counting time    80s                           12s Reel counting quantity       1800 reel                     1920 reel 1、Automatic x-ray SMD counter, which eliminates the need to unpack the bag and maintain the integrity of the roll without affecting the moisture resistance of the material. 2、Automatic x-ray SMD counter greatly reduces the inventory time, eliminating the need for extra manpower, and can assist other people to take over or change lines, shortening the time for line change. 3、Automatic x-ray SMD counter uses digital data to print barcode stickers or upload directly to the database. The traditional Manual SMD counter must have one operator per user, occupying a large space, and the result of the inventory is manually filled in, and it is possible to write a wrong or missed write. 4、Automatic x-ray SMD counter can greatly improve the shortage of material, material loss, material leakage, and material shortage, digitally manage material storage, reduce material inventory cost, and improve material inventory accuracy. 5、For Industry 4.0, the trend of SMT production line, and realize intelligent, less humanized and more efficient. Support the following tray materials: advanced image scattering algorithm – processing connected (high) chips, processing connected (high) chips, automatic feeding of full trays (moisture-proof bags), (automatic) point-distributing chips, accurate counting Overlapping chips, (automatic) the world’s first empty tray detection technology. Family of Industrial X-ray inspection machine & BGA rework station Last Article: Method for detecting electronic components quickly Next Article:x ray inspect PCB and SMT patch module TSI Mexico use Seamark x ray machine Persang Alloy Industries X ray 6600 for PCB Maybe you still are interested in: Solder paste printing defects and solutions in SMT chip processing process Advantages of X-ray SMD counter ...

Publisher: Seamark zm Tech Group

Seamark zm Tech Group

Seamark ZM PCB BGA X-ray Inspection system Equipment -14 years experience in SMT field, Our experience will provide good solutions. X-Ray Inspection, BGA reworks tation,Full auto X ray SMD component machine

Shenzhen, China, China

Inspection

Attaching Fiber Optic Modules

Aug 01, 2019 | ACI Technologies, Inc.

Optical fibers transmit information in the form of pulses of light. The advantages of optical fibers over traditional copper wires include: higher throughput, greater signal distance and speed, smaller cable mass and diameter, greater pull tension limit, and resistance to electromagnetic interference (EMI) and radio frequency interference(RFI). The disadvantages of fiber optics when compared to copper wires include: end-face defects, cleanliness, and the ease of attaching connectors to electronics assemblies (Figure 1)....

Publisher: ACI Technologies, Inc.

ACI Technologies, Inc.

ACI, an authorized IPC Training Center operating the National Electronics Manufacturing Center of Excellence providing analytical testing, manufacturing and repair services to the electronics industry.

Philadelphia, Pennsylvania, USA

Design, IPC Standards Certification Center, Consultant, Service Provider, Training Provider

Design Parameters Influening Reliability of CCGA Assembly; a Sensitivity Analysis

Jul 30, 2019 | Amaneh Tasooji, Antonio Rinaldi - Arizona State University, Reza Ghaffarian - Jet Propulsion Laboratory

Area Array microelectronic packages with small pitch and large I/O counts are now widely used in microelectronics packaging. The impact of various package design and materials/process parameters on reliability has been studied through extensive literature review. Reliability of Ceramic Column Grid Array (CCGA) package assemblies has been evaluated using JPL thermal cycle test results (-50°/75°C, -55°/100°C, and -55°/125°C), as well as those reported by other investigators. A sensitivity analysis has been performed using the literature data to study the impact of design parameters and global/local stress conditions on assembly reliability. The applicability of various life-prediction models for CCGA design has been investigated by comparing model's predictions with the experimental thermal cycling data. Finite Element Method (FEM) analysis has been conducted to assess the state of the stress/strain in CCGA assembly under different thermal cycling, and to explain the different failure modes and locations observed in JPL test assemblies....

Publisher: Jet Propulsion Laboratory

Jet Propulsion Laboratory

The JPL is the lead U.S. center for robotic exploration of the solar system, and conducts major programs in space-based Earth sciences and astronomy.

Pasadena, California, USA

IPC Standards Certification Center, Training Provider

Conformal Coating Processes

Jul 29, 2019 | ACI Technologies, Inc.

ACI Technologies can assist its users with process development and experimentation through the use of the conformal coating capabilities in the Demonstration Factory. Four types of coating processes are available at ACI Technologies: dip coating, manual spray coating, programmable spray coating, and manual brush application. (Manual brush application will not be discussed in this article.)...

Publisher: ACI Technologies, Inc.

ACI Technologies, Inc.

ACI, an authorized IPC Training Center operating the National Electronics Manufacturing Center of Excellence providing analytical testing, manufacturing and repair services to the electronics industry.

Philadelphia, Pennsylvania, USA

Design, IPC Standards Certification Center, Consultant, Service Provider, Training Provider

Carrier tape introduction and classification

Jul 27, 2019 | James tong

Carrier Tape refers to a strip product used in the field of electronic packaging, which has a specific thickness, and equidistantly distributes holes (also called pockets) for holding electronic components in the longitudinal direction thereof. Positioning hole for index positioning....

Publisher: Sewate Technology Co.,Ltd

Sewate Technology Co.,Ltd

Sewate professionally produce ESD protective packaging systems such as ic shipping tubes, plastic anti static ic tubes,, carrier tape, cover tape and reel for electronic component

Shenzhen, China

Antistatic, Component Packaging, Tape and Reel Services

Voiding Performance with Solder Pastes Containing Modified SAC Alloys for Automotive Applications in Bottom Terminated Component Assemblies

Jul 24, 2019 | Brook Sandy-Smith

Voiding is a key concern for components with thermal planes because interruptions in Z-axis continuity of the solder joint will hinder thermal transfer. When assembling components with solder paste, there is a high propensity for voiding due to the confined nature of the solder paste deposits under the component. Once reflowed, many factors contribute to the amount of voiding in a solder joint such as the reflow profile, designs of the component, board and stencil, and material factors. This study will focus on the solder paste alloy and flux combination as well as profile and board surface finishes....

Publisher: Indium Corporation

Indium Corporation

Solder pastes, solder preforms, solder spheres, soldering fluxes, electrically-conductive adhesives. All alloys: tin-lead, lead-free, indium alloys, and more.

Utica, New York, USA

Manufacturer of Assembly Material, Soldering

Common Process Defect Identification of QFN Packages

Jul 23, 2019 | David Bernard @ Dage Precision Industries, Bob Willis @ ASKbobwillis.com

The Quad Flat Pack No Leads (QFN) style of leadless packaging [also known as a Land Grid Array (LGA)] is rapidly increasing in us e for wireless, automotive, telecom and many other areas becaus e of its low cost, low stand-off height and excellent thermal and electri cal properties. With the implementation of any new package type, there is always a learning curve for its use in design and processing as well as for the Process and Quality Engineers who have to get to grips with the challenges that these packages bring. Therefore, this paper will provide examples of the common process defects that can be seen with QFNs /LGAs when using optical and x-ray inspection as part of manufacturing quality control. Results of trials conducted on four PCB finishes and using vapour phase and convection reflow will be discussed....

Publisher: Nordson DAGE

Nordson DAGE

The leading provider of award winning bond testing equipment and continues to invest significantly in research and development to remain at the cutting edge of bond tester technology.

Aylesbury. Buckinghamshire, United Kingdom

Inspection, Test Services

A Systematic Approach to RoHS Analysis

Jul 19, 2019 | ACI Technologies, Inc.

One of the most frequently asked questions of ACI Technologies (ACI) is how to qualify and verify that the electronic systems shipped by their respective companies are Restriction of Hazardous Substances (RoHS) compliant. The RoHS directive has been implemented since July of 2006, and the preoccupation with what constitutes a compliant product continues to confuse the electronic industry. ACI receives countless inquiries regarding how to qualify and verify that the electronic systems shipped by the irrespective companies are RoHS compliant. The approach to proving compliancy requires a sequential analytical process that utilizes a decision flow chart....

Publisher: ACI Technologies, Inc.

ACI Technologies, Inc.

ACI, an authorized IPC Training Center operating the National Electronics Manufacturing Center of Excellence providing analytical testing, manufacturing and repair services to the electronics industry.

Philadelphia, Pennsylvania, USA

Design, IPC Standards Certification Center, Consultant, Service Provider, Training Provider

Foxconn x ray inspection

Jul 19, 2019 | Joy Rong +8618779975930 info@seamarkxray.com

Foxconn x ray inspection Seamark zm x ray series and BGA rework station series had enter Mainland Foxconn already, our target let worldwide’ Foxconn factories use our x ray inspection machine and x ray smd counter in the future. This Year,Vietnam Foxconn (Hon Yao Fu Technology Company Limited)purchased our x ray x6600 inspection machine, and we have finished training service In Vietnam Foxconn factory. Foxconn x ray inspection image Foxconn are using our x ray inspection machine series, how about you?If not, Let’s do it! Family of Industrial X-ray inspection machine & BGA rework station Last Article: Method for detecting electronic components quickly Next Article:x ray inspect PCB and SMT patch module TSI Mexico use Seamark x ray machine Persang Alloy Industries X ray 6600 for PCB Maybe you still are interested in: Solder paste printing defects and solutions in SMT chip processing process Advantages of X-ray SMD counter ...

Publisher: Seamark zm Tech Group

Seamark zm Tech Group

Seamark ZM PCB BGA X-ray Inspection system Equipment -14 years experience in SMT field, Our experience will provide good solutions. X-Ray Inspection, BGA reworks tation,Full auto X ray SMD component machine

Shenzhen, China, China

Inspection

Via Fill and Through Hole Plating Process with Enhanced TH Microdistribution

Jul 17, 2019 | Maria Nikolova, Confesol Rodriguez, Kesheng Feng, Carmichael Gugliotti, William Bowerman, Jim Watkowski, Bob Wei

The increased demand for electronic devices in recent years has led to an extensive research in the field to meet the requirements of the industry. Electrolytic copper has been an important technology in the fabrication of PCBs and semiconductors. Aqueous sulfuric acid baths are explored for filling or building up with copper structures like blind micro vias (BMV), trenches, through holes (TH), and pillar bumps. As circuit miniaturization continues, developing a process that simultaneously fills vias and plates TH with various sizes and aspect ratios, while minimizing the surface copper thickness is critical. Filling BMV and plating TH at the same time, presents great difficulties for the PCB manufactures. The conventional copper plating processes that provide good via fill and leveling of the deposit tend to worsen the throwing power (TP) of the electroplating bath. TP is defined as the ratio of the deposit copper thickness in the center of the through hole to its thickness at the surface.</p> <p>In this paper an optimization of recently developed innovative, one step acid copper plating technology for filling vias with a minimal surface thickness and plating through holes is presented....

Publisher: MacDermid Inc.

MacDermid Inc.

MacDermid is a global provider of specialty chemicals for the most complex printed circuit board designs. We specialize in the areas of final finishes, through-hole metallization, and circuit formation.

Waterbury, Connecticut, USA

Manufacturer of Assembly Material, Antistatic

Design of Experimentation for Affordability

Jul 11, 2019 | ACI Technologies, Inc.

Affordability is not exactly the primary word which comes to mind when discussing the use of design of experiments (DOE) principles, but is generally accepted as a necessary part of the engineering activities required in the development of a product or process. However, a number of studies have indicated that the cost savings derived from a well deliberated experimental design can be substantial in the initial stages where the conditions or parameters of a process are determined. Some studies have shown a greater than 50% cost savings compared to the more conventional means of trial and error approaches to process development. At ACI Technologies (ACI), we have found the use of DOE techniques fundamental in eliminating extraneous costs otherwise spent on unnecessary testing....

Publisher: ACI Technologies, Inc.

ACI Technologies, Inc.

ACI, an authorized IPC Training Center operating the National Electronics Manufacturing Center of Excellence providing analytical testing, manufacturing and repair services to the electronics industry.

Philadelphia, Pennsylvania, USA

Design, IPC Standards Certification Center, Consultant, Service Provider, Training Provider

Void Reduction in Bottom Terminated Components Using Vacuum Assisted Reflow

Jul 10, 2019 | M. Barnes, D.W. Lee, D. Heller - Heller Industries, M.Holtzer, T. Cucu - Alpha Assembly Solutions, J. Fudala, J. Renda - MacDermid Enthone Electronic Solutions

Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation....

Publisher: Heller Industries Inc.

Heller Industries Inc.

Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.

Florham Park, New Jersey, USA

Manufacturer of Assembly Equipment, Soldering, OEM

Fourier Transform Infrared Spectroscopy

Jul 05, 2019 | ACI Technologies, Inc.

Fourier Transform Infrared (FTIR) spectroscopy exists as one of the most powerful techniques for chemical identification and the most practical for “first step” analysis. Analytical instrumentation such as GC-MS and LC-MS are commonly used for identifying organic compounds. However, these techniques are costly and often require extensive set up time, method development, and sample alteration. Reliance upon FTIR as a robust and versatile tool can be based on its attributes of simplicity, speed, sensitivity, and affordability....

Publisher: ACI Technologies, Inc.

ACI Technologies, Inc.

ACI, an authorized IPC Training Center operating the National Electronics Manufacturing Center of Excellence providing analytical testing, manufacturing and repair services to the electronics industry.

Philadelphia, Pennsylvania, USA

Design, IPC Standards Certification Center, Consultant, Service Provider, Training Provider

Reduce Pollution of Process Gasses in an Air Reflow Oven

Jul 02, 2019 | Gerjan Diepstraten

The introduction of lead-free solders resulted in a selection of different chemistries for solder pastes. The higher melting points of lead-free alloys required thermal heat resistant rosin systems and activators that are active at elevated temperatures. As a result, more frequent maintenance of the filtration systems is required and machine downtime is increased.</p><p>Last year a different method of cleaning reflow ovens was introduced. Instead of cooling down the process gasses to condensate the residues, a catalyst was used to maintain the clean oven. Catalytic thermal oxidation of residues in the nitrogen atmosphere resulted in cleaner heating zones. The residues were transformed into carbon dioxide. This remaining small amount of char was collected in the catalyst. In air ovens the catalyst was not seen as a beneficial option because the air extracted out of the oven was immediately exhausted into the environment. When a catalyst is used in an air environment there is not only the carbon dioxide residues, but also water. When a catalyst is used in an air reflow oven the question is where the water is going to. Will it condensate in the process part of the oven or is the gas temperature high enough to keep it out of the process area? A major benefit of using a catalyst to clean the air before it is exhausted into the environment is that the air pollution is reduced dramatically. This will make environmental engineers happy and result in less pollution of our nature. Apart from this, the exhaust tubes remain clean which reduces the maintenance of air ovens.</p><p>This paper will give more detailed information of catalyst systems during development and performance in production lines....

Publisher: Vitronics Soltec

Vitronics Soltec

Global manufacturer of XPM Reflow Ovens, ZEVA Selective Soldering and Delta Wave Soldering Equipment.

Camdenton, Missouri, USA

Manufacturer of Assembly Equipment, Soldering, Selective Soldering

Computer Aided Design, Manufacturing, and Engineering

Jul 01, 2019 | ACI Technologies, Inc.

In the electronics industry of today, companies emphasize better quality, lower cost, and shorter lead time on their products in order to keep up with their competitors. ACI Technologies (ACI) has been utilizing Computer Aided Design (CAD), Computer Aided Manufacturing(CAM), and Computer Aided Engineering (CAE) in its development of advanced electronics systems. CAD utilizes computer systems to assist in the creation, modification, analysis, and optimization of a design [1]....

Publisher: ACI Technologies, Inc.

ACI Technologies, Inc.

ACI, an authorized IPC Training Center operating the National Electronics Manufacturing Center of Excellence providing analytical testing, manufacturing and repair services to the electronics industry.

Philadelphia, Pennsylvania, USA

Design, IPC Standards Certification Center, Consultant, Service Provider, Training Provider

Automotive parts X ray Inspection

Jun 27, 2019 | Joy Rong +8618779975930 info@seamarkxray.com

Automotive parts X ray Inspection Yinghao Car Parts Limited Company located in Shunxiang Rd, Shunde Qu, Foshan Shi, Guangdong Sheng, China. Mainly provide plastic parts of automotive parts, electronic components, hardware products since 2010, mainly supporting Toyota, Honda, Nissan and Mitsubishi. Yinghao Car parts Limited Company brought X Ray inspection machine X5600 for they’ Lab, X5600 is mini size for lab. We believe that they must know In the fierce market, the company can only seek better development in the context of continuous improvement of its core competitiveness. Join us! Let more production plants/factories focus on quality, and make our lives better!...

Publisher: Seamark zm Tech Group

Seamark zm Tech Group

Seamark ZM PCB BGA X-ray Inspection system Equipment -14 years experience in SMT field, Our experience will provide good solutions. X-Ray Inspection, BGA reworks tation,Full auto X ray SMD component machine

Shenzhen, China, China

Inspection

Advanced Cu Electroplating Process for Any Layer Via Fill Applications with Thin Surface Copper

Jun 26, 2019 | Saminda Dharmarathna, Christian Rietmann, William Bowerman, Kesheng Feng, Jim Watkowski

Copper-filled micro-vias are a key technology in high density interconnect (HDI) designs that have enabled increasing miniaturization and densification of printed circuit boards for the next generation of electronic products. Compared with standard plated through holes (PTHs) copper filled vias provide greater design flexibility, improved signal performance, and can potentially help reduce layer count, thus reducing cost. Considering these advantages, there are strong incentives to optimize the via filling process. This paper presents an innovative DC acid copper via fill formulation, for VCP (Vertical Continues Plating) applications which rapidly fills vias while minimizing surface plating....

Publisher: MacDermid Inc.

MacDermid Inc.

MacDermid is a global provider of specialty chemicals for the most complex printed circuit board designs. We specialize in the areas of final finishes, through-hole metallization, and circuit formation.

Waterbury, Connecticut, USA

Manufacturer of Assembly Material, Antistatic

Manufacturing Cost Reduction through Automation

Jun 24, 2019 | ACI Technologies, Inc.

Defense systems and its manufacturers are often blamed for not embracing new and innovative technologies to manufacture products compared to its commercial counterparts. Commercial product manufacturers are known to think “outside the box” in coming up with new products which are cheaper, have fewer parts, and easier to manufacture using automation. Automation leads to consistent quality products which are reliable and reproducible. Implementing some of these producibility design practices into defense systems will greatly reduce the cost and insertion time for new products....

Publisher: ACI Technologies, Inc.

ACI Technologies, Inc.

ACI, an authorized IPC Training Center operating the National Electronics Manufacturing Center of Excellence providing analytical testing, manufacturing and repair services to the electronics industry.

Philadelphia, Pennsylvania, USA

Design, IPC Standards Certification Center, Consultant, Service Provider, Training Provider

Investigation of Through-Hole Capacitor Parts Failures Following Vibration and Stress Testing

Jun 21, 2019 | ACI Technologies, Inc.

Recently, an ACI Technologies (ACI) customer called to discuss failures that they had observed with some through-hole capacitor parts. The components were experiencing failures following vibration and accelerated stress testing. Upon receipt of the samples, ACI performed three levels of inspection and Energy Dispersive Spectroscopy (EDS) testing to investigate the root cause of the failures. These analyses enabled ACI to verify the elements comprising the solder joints and make the following recommendations in order to prevent future occurrences. The first inspection was to investigate the capacitor leads using optical microscopy, and no anomalies were found that could indicate bad parts from the vendor or improper handling prior to assembly. However, vertical fill in the barrel of the plated through-holes was too close to the IPC-A-610 minimum specification of 75% to determine a pass/fail condition, and therefore required further investigation....

Publisher: ACI Technologies, Inc.

ACI Technologies, Inc.

ACI, an authorized IPC Training Center operating the National Electronics Manufacturing Center of Excellence providing analytical testing, manufacturing and repair services to the electronics industry.

Philadelphia, Pennsylvania, USA

Design, IPC Standards Certification Center, Consultant, Service Provider, Training Provider

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conformal coating pcb - asymtek