| | I am trying to solder a 388 ball BGA to an Andon Electronics Corp. BGA socket adapter and I am having problems in the reflow of this part. I put no clean paste flux in the solder cups of the adapter then put the BGA part onto the adapter and run it through a Heller 988C air reflow convection oven. The BGA part is not soldering to the socket adapter properly - ball collapse, especially on opposite corners, actually warps part down, solder shorts fron excess solder flow. | | Has anyone ever used these adapters with success? Adapter manufacturer could not help me. | | My oven is a 4 zone oven and I set it as follows: | | 150 deg.C, 180 deg.C, 190 deg.C and 250 deg.C at a belt speed of 23 cm. per minute. | | Any help on a correct profile or on what I am doing wrong would be appreciated. | | | I can only comment on what you already know. Corners are hottest. Therefore, they reflow first - when all else is as required. So, you might rethink your profile to provide either more heat or longer duration in various zones for the paste you selected. A particular profile will reflow all corners and sides equally. | | Earl Moon | I have used BGA357 pin grid socket adapters in the past with reasonable success. I use my rework station (SRT Sierra 1000) to complete the reflow. First I make a holding fixture out of FR4, just a square opening to drop the socket in. Then I put a thin coat of TacFlux on the socket pads. I can then use the vision from the SRT to place the BGA on the socket. I have run the following profile, Preheat w/ a 2 deg. C per second ramp, 175 deg. top and 150 deg. bot for 30 seconds. Reflow w/ the same 2 deg. C per second ramp, 215 deg. top and 200 deg. bot for 40 seconds. I've done several this way with success.
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