If we understand correctly, your SMT solder connections remelt when passing through the wave solder machine and your QA-people don't like it when that happens.
It's nice not to remelt this solder, but as long as the board meets your acceptance standard, there is nothing wrong with solder remelting when passing through the wave. There is no accepted requirement that the solder on SMT connections not melt during wave soldering. Nor should there be.
Generally, first side SMT solder connections remelt during the soldering of second side components in the reflow soldering machine. Is this allowed at your plant? If so, what's the difference?
Talk to the person that made-up this requirement and understand their intent and the benefit of the requirement.
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