Solder Paste Shape Standards

DO you know of an Industry Standard that describes solder paste geometries requirements?

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| DO you know of an Industry Standard that describes solder paste geometries requirements? | If it were only so! Most people I work with, because of so many variables concerning solder paste, its composition, particle size and shape, and application capabilities, do their own DOE's. If they have not integrated 2D or 3D inspection capabilities in their printers, they buy "scopes" to corelate luck with skill.

I always look forward to working with folks seeking answers to this question. If I can be of any help, contact me.

Earl Moon

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| DO you know of an Industry Standard that describes solder paste geometries requirements? | Lyle: The industry standard that describes solder geometries requirement is IPC-A-610. There is no industry standard that describes how solder paste should be deposited to meet that standard. It's up to you to decide how to do it. You can do it any way you want. In some situations a hand "calking gun" style dispenser works great. In a few other situations, that tool may not be appropriate.

Where to start ...

1 Many stencil fabricators are kind and tolerant and will help on a basic level 2 EMPF published something on aperture design a few years ago 3 Several threads on stencil design are in the SMTnet and Technet archives 4 Trade journals like SMT Magazine, EP&P, and Circuits Assembly have printed articles on stencil design 5 Better stencil printing equipment suppliers have published guidelines 6 Better solder paste suppliers have published guidelines. 7 Authors like Prasad, Brinsky, and Blankenhorn have written texts that touch on stencil design, as well as other SMT process areas.

This information will cover the majority of your requirements. There are consultants and SMTneters for the remainder.

Good luck

Dave F

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| DO you know of an Industry Standard that describes solder paste geometries requirements? | Check out www.alphastencil.com and select "Stencil Design Guidelines". This will at least give you an idea of how to deposit optimum paste volumes based on a specific component size. Any other questions, let me know.

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