BGA testing on the Agilent HP5DX x-ray System

Has anyone had any success in finding open circuits (i.e. ball present but not soldered to PCB) under collapsible BGA's using an Agilent HP5DX x-ray tester and the BGA2 algorithm? Can anyone recommend an elongated pad design which produces the necessary difference in good/bad joint appearance to find opens but avoid false calls?

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