We're not clear on what you seek. So, as a starting point for our discussion, we wouldn't get agitated if we saw "routine" coplanarity of 4 thou.
For instance: Maximum Lead Coplanarity [Altera] Package||Acronym||Lead material||Finish||Maximum Lead Coplanarity Plastic dual in-line||PDIP||Copper||Solder plate|| Ceramic J-lead chip carrier||JLCC||Alloy 42||Solder dip||0.006 inches (0.15 mm) Plastic J-lead chip carrier||PLCC||Copper||Solder plate||0.004 inches (0.10 mm) Ceramic pin-grid array ||PGA||Alloy 42||Gold over nickel plate|| Plastic small-outline integrated circuit||SOIC||Copper||Solder plate: 100-pin commercial, Solder dip: 208-pin|| Plastic quad flat pack||PQFP||Copper||Solder plate|| QFP packages with a lead pitch of 0.65 mm or greater||||||||0.004 inches (0.10 mm) QFP packages with a lead pitch of 0.5 mm||||||||0.003 inches (0.08 mm) QFP packages with 208 pins or greater||||||||0.003 inches (0.08 mm) CQFP packages with a lead pitch of 0.5 mm||||||||0.004 inches (0.10 mm) Plastic thin quad flat pack||TQFP||Copper||Solder plate|| Power quad flat pack||RQFP||Copper||Solder plate|| Ball-grid array||BGA||Tin-lead alloy (63/37)||||0.008 inches (0.20 mm)
Do those leads take solder in a standard J-002 "dip & look" solderability test?
reply »