Component manufacturer often have recommendation for pad layout and process setup. This should be used as a guideline to help You to set up the process. Exactly what type of component is this, uBGA?
We populate 64 I/O uBGA's on our pcb's with 0.3 mm pad diameter, 0.127 mm stencil thickness, square apertures in the stencil and same aperture diameter. Solder paste: Indium NC-SMQ 92J.
There are a lot of different component packages on the same pcb; from 0402, ssop, tssop, soic, Pin In Paste connectors up to QFP 304 pin and big 50 mm x 30 mm 5.08 mm pitch DC/DC converter. Of course with different apertures...
This works perfectly without any problem for us!!
Mika
reply »