Hi all,
In general, I am looking at restructuring of our rework processes in our factory. Despite all the effort put into design, process, material etc, there will always be some assemblies that must be repaired. Over the years, alot of hi-technology packages were introduced in our factory, reject rate at rework processes were inconsistent, be it from a simple BGA to a stacked BGAs and to a fine uBGA. To cut the story short, I wanted to go back to basic but just don't know where to start. Any of you have any recommendations for me to start with. What are the items I should look at.
Inputs are much appreciated.
thanks.
reply »