Voids

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we are observing voids in solder ball bonding process using ... - Mar 01, 2006 by Ajay

Ajay

#40094

Voids | 1 March, 2006

we are observing voids in solder ball bonding process using laser.Final metal finish is of Au on Cu.Can anyone tell me the reasons or solution for this problem.We are not using any flux at all.

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