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This company listing was last updated in October 2016

TE Connectivity

A technology leader in the world's fastest growing markets, helping connect power, data and signal in everything from automotive and aerospace to broadband communications, consumer, energy and industrial applications.

Manufacturer, Standards Setting / Certification, Training Provider

TE Connectivity, Ltd., previously known as Tyco Electronics, Ltd., and formerly a segment of Tyco International, designs and manufactures highly engineered solutions that connect and protect data and power. The company serves customers in more than 150 countries in a variety of industries including automotive; data communication systems; consumer electronics; telecommunications; aerospace, defense and marine; medical; energy; and lighting. With approximately 500,000 products, TE connectivity solutions touch nearly every aspect of our lives.

TE Connectivity Postings

5 technical articles »

Full Material Declarations: Removing Barriers to Environmental Data Reporting

Sep 04, 2019 | Roger L. Franz

Since the European Directives, RoHS (Restriction of Hazardous Substances) and REACH (Registration, Evaluation, Authorization and Restriction of Chemicals), entered into force in 2006-7, the number of regulated substances continues to grow. REACH adds new substances roughly twice a year, and more substances will be added to RoHS in 2019. While these open-ended regulations represent an ongoing burden for supply chain reporting, some ability to remain ahead of new substance restrictions can be achieved through full material declarations (FMD) specifically the IPC-1752A Class D Standard (the "Standard"), which was developed by the IPC - Association Connecting Electronic Industries. What is important to the supply chain is access to user-friendly, easily accessible or free, fully supported tools that allow suppliers to create and modify XML (Extensible Markup Language) files as specified in the Standard. Some tools will provide enhancements that validate required data entry and provide real-time interactive messages to facilitate the resolution of errors. In addition, validation and auto-population of substance CAS (Chemical Abstract Service) numbers, and Class D weight rollup validation ensure greater success in the acceptance of the declarations in customer systems that automate data gathering and reporting. A good tool should support importing existing IPC-1752A files for editing; this capability reduces the effort to update older declarations and greatly benefits suppliers of a family of products with similar composition. One of the problems with FMDs is the use of "wildcard" non-CAS numbers based on a declarable substance list (DSL). While the substances in different company's lists tend to have some overlap, no two DSL’s are the same. We provide an understanding of the commonality and differences between representative DSLs, and the ability to configure how much of a non-DSL substance percent is allowed. Case studies are discussed to show how supplier compliance data, can be automatically loaded into the customer's enterprise compliance system. Finally, we briefly discuss future enhancements and other developments like Once an Article, Always an Article (O5A) that will continue to require IPC standards and supporting tools to evolve....

Stereolithography and Simultaneous Engineering Speed Products to Market

May 07, 1999 | AMP Incorporated

Stereolithography is a handy tool not only for speeding a design to market but also in giving customers an early edge. By allowing a form-and-fit sample to be quickly made from a computer model, stereolithography coupled with simultaneous engineering allows customers to see product models early in the design cycle. And if a picture is worth a thousand words, what's a tangible sample worth?...

Solder Volumes for Through-Hole Reflow-Compatible Connectors

May 06, 1999 | AMP Incorporated

The success of surface-mount technology has not meant the end of through-hole connectors. For reasons ranging from availability to user concerns over reliability, through-hole connectors remain widely used. ...

Keeping Tin Solderable

May 06, 1999 | AMP Incorporated

Tin plating on a component lead makes its soldering easier. Everybody knows that. Not so well known is that tin plating has shelf life -- its ability to be easily soldered degrades over time. the speed and severity of degradation depends both on storage conditions and on the plating itself......

Specifying Current for the Real World

May 06, 1999 | TE Connectivity

To help the designer set the appropriate current level, AMP has developed a new method of specifying current-carrying capacity. This new method takes into account the various application factors that influence current rating. ...

67 news releases »

Tyco Electronics (TE) Launches New Corporate Responsibility Program and Report

Jan 18, 2011 | Tyco Electronics Ltd. announced today the launch of the Tyco Electronics Responsibility Advantage (TERA) program and the release of its first corporate responsibility report. The TERA program brings together the existing environmental, supply chain, workplace, governance, community and other related programs within TE.

Tyco Electronics Completes Acquisition of ADC

Dec 09, 2010 | Tyco Electronics Ltd today announced the completion of the acquisition of ADC Telecommunications, Inc. (Nasdaq: ADCT). The combination of Tyco Electronics (TE) and ADC positions the company as a world leader in broadband connectivity.

Tyco Electronics Plans Name Change to TE Connectivity Ltd.

Dec 03, 2010 | Tyco Electronics Ltd today announced that it plans to change its name to TE Connectivity Ltd., subject to shareholder approval at the company's Annual General Meeting of Shareholders to be held on March 9, 2011.

Tyco Electronics Reports Strong Fiscal Fourth Quarter and Full Year 2010 Results

Oct 30, 2010 | Tyco Electronics today reported results for the fiscal fourth quarter ended Sept. 24, 2010. The company reported a net sales increase of 16 percent year-over-year, and 2 percent sequentially, to $3.1 billion.

Tyco Electronics to Present at the Citi Global Technology Conference

Sep 02, 2010 | Tyco Electronics Ltd. (NYSE: TEL) today announced that its Chief Financial Officer, Terrence Curtin, will be presenting at the Citi Global Technology Conference in New York City on Sept. 8, 2010 at 10:20 a.m. EDT.

Tyco Electronics Announces Record and Payment Dates for Fiscal 2010 Fourth Quarter Dividend of $0.16

Aug 28, 2010 | Tyco Electronics Ltd. (NYSE: TEL) today announced that the $0.16 per share quarterly dividend for the fourth fiscal quarter of 2010 will be payable on September 15, 2010 to shareholders of record at the close of business on September 7, 2010, subject to a required filing with the Swiss Commercial Register.

Tyco Electronics Extends Tender Offer for ADC

Aug 24, 2010 | Tyco Electronics (NYSE: TEL) announced today that it has extended the expiration of its tender offer to purchase all of the outstanding common shares of ADC (Nasdaq: ADCT), at a price of $12.75 per share in cash, to midnight, New York City time on Monday, September 20, 2010.

Tyco Electronics to Acquire ADC, Creating a World Leader in Broadband Connectivity

Jul 16, 2010 | Tyco Electronics (NYSE: TEL) and ADC (Nasdaq: ADCT) announced today a definitive agreement under which Tyco Electronics will acquire ADC for $12.75 per share in cash, or an enterprise value of approximately $1.25 billion.

Tyco Electronics to Report Fiscal Third Quarter Results on July 22, 2010

Jun 30, 2010 | Tyco Electronics Ltd. (NYSE: TEL) will report fiscal third quarter results before trading begins on Thursday, July 22, 2010. The company will hold a conference call for investors at 8:30 a.m. EDT. The call can be accessed in the following ways:

Tyco Electronics Announces Record and Payment Dates for Fiscal 2010 Third Quarter Dividend of $0.16

May 11, 2010 | SCHAFFHAUSEN, Switzerland - Tyco Electronics Ltd. (NYSE: TEL) today announced that the $0.16 per share quarterly dividend for the third fiscal quarter of 2010 will be payable on June 16, 2010 to shareholders of record at the close of business on June 8, 2010, subject to a required filing with the Swiss Commercial Register.

57 more news releases from TE Connectivity »

Voidless Reflow Soldering

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