NxgenElectronics
All aspects of electronic interconnect solutions are available, including package and substrate design and lay-out, thermal analysis, high-speed simulation, process development, test engineering, and materials procurement. Technology assessment generally involves short turnaround times and consist of one or more of the following activities:
A Message from the Chief Executive Officer
At NxGEN we specialize in the design, manufacture and test of ultra-miniature microelectronic devices. Over the years, we have consistently provided successful services incorporating state-of-the-art materials and process technology. NxGEN has a very strong team of seasoned professionals.
Our design and manufacturing expertise has resulted in some of the smallest packaging outlines in the industry. As the global demand for even smaller microelectronic devices in multiple markets grows, NxGEN is well positioned to lead the way.
NxGEN is located at 9771 Clairemont Mesa Blvd., San Diego, CA, 92124, with all activities centralized in a modern, 16,000 square foot, fully automated facility with our electronics manufacturing services and products produced on advanced equipment in a clean room environment.
The semiconductor device industry continues to drive for smaller �feature� sizes, allowing them to introduce more functionality into the same or smaller space. Semiconductor densities have doubled every 18 months for over a decade. However, the packaging technology employed to house the semiconductor devices, supporting their integration into smaller hand-held and portable units, has not improved at the same pace.
Clearly this is the NxGEN challenge. NxGEN believes that it has a strategic advantage in packaging technology and is using this advantage to grow its EMS business and support new products for NxGEN and our clients.
We are proud of our accomplishments in the past four years and are poised for substantial growth in 2007 and beyond.
Warm regards and welcome,
Richard D. Brunsell
Chief Executive Officer
NxGEN Electronics
NxgenElectronics Postings
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Aluminum Wirebonding Gold Wirebonding Gold Ribbonbonding Wafer Bumping Flip Chip Packaging BGA LGA SMT Direct Chip Attach System In Package Hybrid MCM Stacked Die 3D Packaging 3D Memory Rad Hard RF Packaging...
