Selective Soldering System-H
Company Information:
Name: |
Selective Soldering System-H |
Category: |
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Offered by: |
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Selective Soldering System-H Description:
Selective Soldering System-H
Specifications:
MODEL |
HPS 4/46 |
HPS 4/35S |
|
Equipment parameters |
Dimension(L×W×H) |
2450x1845x1565 (mm) |
2450 x 2055 x 1665 (mm) |
Transport Parameters |
Transport width adjustment |
50-460 (mm) |
50-350 (mm) |
PCB size |
510 x 460 (mm) , 610 x 610 (mm) |
510 x 350 (mm) |
|
Conveyor height |
900±20(mm) |
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The soldering system |
Solder pot |
electromagnetic pump tin solder pot |
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The amount of tin dross |
0.5KG/pot/week x1 |
0.5KG/pot/week x2 |
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Nitrogen consumption |
1.5-2m³/h/potx1 |
1.5-2m³/h/potx2 |
|
solder pot numbers |
single track single pot/single track dual pots |
dual tracks dual pots |
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module numbers |
one module/two modules |
three modules |
single pot
dual pots
dual pots individual control
FLUX SPRAY MODULE
Introduction:
The spray head which is imported from Germany offers an absolutely precise and
well defined flux deposition on even the smallest areas. The flux is targeted to be
applied only to the solder joint,whereby the wettable area can be as small as 3
mm.with the effect that ionic contamination is minimized and flux consumption is
reduced.
Features Of Machine:
Saving 90%flux compared to traditional mode.
The wettable area can be as small as 3mm, minimize the effect of ionic contamination, meanwhile boards cleaning free.
Two axis servo motor control, high positioning accuracy.
Minimum ionic contamination.
Specifications:
Flux Module |
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Flux module x axis distance (max.) |
510mm |
Flux module y axis distance (max.) |
450mm |
Max. nozzle speed |
7m/min |
Flux content |
2 L |
Flux type |
RO, RE and OR and with the effective standard of L0, L1, M0, according to IEC 61190-1-1 |
Flux effective level |
L0, L1, M0 |
Nozzle |
130 μm, alternative diameter |
Spray pressure |
0.5~1.0 bar |
Spray width |
2~8 mm (with spray nozzle 130 μm) |
Spray speed |
20 mm/s |
Positioning speed |
400 mm/s |
Positioning accuracy |
±0.2 mm |
Flux system |
2-axis With Servo Drive |
Flux Spray Module
Germany Flux Nozzle
PREHEATING MODULE
Introduction:
The current selective soldering processes, in particular those for lead-free soldering,
multi-layer boards or high mass components, call for increased preheat capacities.
Short wave IR heater on the bottom and hot air convective preheating on the top, to
ensure preheating evenly.
Features Of Machine:
1, Segmented & modular layout, preheating more flexibly.
2, Lower short wave IR preheating on the bottom,increasing the efficiency.
3, Hot air convection preheating on the top, preheating more evenly (optional).
Specifications:
Preheating module |
|
Top heater power |
4KW |
Top heater voltage |
220V |
Bottom heater powerr |
4.8KW |
Bottom heater voltage |
220V |
CDA pressure |
0.5-0.7MPa |
PREHEATING MODULE
Bottom Short Wave IR Preheating
SOLDERING MODULE
Advantages Of Using Induction Pump:
1,3-axis servo drives, high control precision.
2,Min.nozzle diameter is 3mm,point or track soldering available according to different through hole components.
3,Max.solder wave height is 5mm and controllable,soldering climb rate increased largely.
4,Dual-pot optional, highest flexible.
5,Nitrogen protection, only minute amounts of dross.
6,Pot temperature are continuously monitored.
7,Wave height monitoring available.
8,Solder level monitoring available.
9,No mechanical movement and no wearing.Solder wave stable and reliable.
Specifications:
Soldering module |
|
Solder nozzle position |
Middle |
Solder content |
13 Kg |
Max. soldering temperature |
350 °C |
Min. internal diameter of solder nozzle |
3 mm, External Diameter 4.5 mm |
Max. Solder wave height |
5 mm |
Soldering speed X、Y-axis |
10 mm/s |
Positioning speed X、Y-axis |
200 mm/s |
Positioning speed Z-axis |
100 mm/s |
Positioning accuracy |
±0.15 mm |
Max.solder distance(x axis) |
510mm |
Max.solder distance(y axis) |
460mm |
Max.distance of z-axis |
58mm |
Max.pot moving speed |
5.8m/min |
Control system |
3-axis With Servo Drive |
SOLDERING MODULE
Contact: Jacky.li@samtronik.com
Selective Soldering System-H was added in Nov 2020
Selective Soldering System-H has been viewed 84 times
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