Extremely fast and precise inspection for high-volume production.
The S3088 ultra chrome is designed to meet the demand for high throughput production lines, inspect the most leading-edge electronics, and be cost competitive. This system is based on the unique 3D AOI technology from V...
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Inspection |
Reliable optical inspection of wave, reflow, pre-reflow and selective soldering.
More than an entry into AOI
Optimal, ergonomic loading through large opening angle
Superior resolution, reliable 01005 and fine-pitch inspection
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Inspection |
Solder joint inspection of bottom-side PCBs
Intelligent Inspection of Solder Joints, THT and SMD Components
Today, the industry standard quality assurance in electronics production is automatic optical inspection (AOI) of SMD components on printed circuit bo...
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Inspection |
Full Viscom 2.5D defect detection coverage for placement and solder joint inspection.
Extremely reliable, proven inspection for reflow, pre-reflow, wave and selective soldering
Revolutionary simplicity in AOI operation with vVision
Scalab...
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Inspection |
Extremely reliable, proven inspection for wave, reflow, pre-reflow and selective soldering.
The S3088 flex AOI system was developed for reliable, economical defect detection and fast process optimization. From prototypes to large volume, this flexible platform with sc...
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Inspection |
S3088 ultra with high-performance sensor technology XM 3D - the new standard in assembly inspection.
High-speed solder joint inspection. Highest inspection depth. Simple operation.
In today's electronics manufacturing environment, reliable and economical quality assura...
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Inspection |
Powerful 3D AOI solution for accurate inspection results.
The S3088 ultra blue addresses the growing demand for reliable and easy-to-use 3D AOI technology at an economical price. Viscom’s powerful approach is a combination of high quality, cost-effective machine design and stand...
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Inspection |
The inspection system S3088 UFI was developed specifically for reliable, cost-effective defect detection and fast process optimization. A versatile inspection concept with scalable, modular camera technology enables dependable inspection of under fillings of BGAs, Flip Chips and other components ...
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Inspection |
The long-term inspection solution for wave, reflow, pre-reflow and selective soldering.
In the manufacturing of electronic assemblies, optimization of the production processes is a major factor in the success of producing to the high demands of quality and delivery. It is here that th...
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Inspection |
In-line X-ray and optical inspection for high-end electronics production.
TRAILBLAZING X-RAY TECHNOLOGY AND ULTRA-MODERN XM CAMERA TECHNOLOGY IN ONE SYSTEM.
The in-line X-ray system X7056-II is primarily distinguished by high throughput and first-class 3D image quality. It...
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Inspection |
The world's first and only combo system with simultaneous 3D AOI and 3D AXI. It’s a unique solution for maximum efficiency and flexibility in PCB inspection, combining extreme reliability and effective process control.
Optical and simultaneous 2-D, 2.5-D and 3-D X-ray Inspe...
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Inspection |
High Performance 3-D Solder Paste Inspection with Quality Uplink
Extremely fast and highly accurate in-line inspection
Viscom's S3088 SPI inspection system is an extremely fast and highly precise inline system for 3-D solder paste inspection
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Inspection |
The Viscom S3088 CCI checks for the completeness of conformal coating on PCBs, and is intelligently linked to other inspection gates from Viscom.
Reliable, precise detection of coating voids.
Transparent conformal coating protects electronics assemblies against damage from...
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Inspection |
This compact AOI system was developed to inspect medium and small product runs. During inspection, a high-resolution camera records all bond sites and wires. Dies, bond sites, wire course and component position are only a part of the inspection scope. It makes no difference whether the bonds are ...
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Inspection |
High accuracy inspection guarantees reliable defect detection of die bonds, ball-to-wedge, wedge-to-wedge and security bonds
Inspection of minimal wire thicknesses up to 15 µm
Reliable differentiation of wire courses
Recognition of defective bonds
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Inspection |
Fast automatic inspection and high performance sample testing in one system.
Two inspection concepts in one system - The best of two worlds.
In modern SMT production, components such as BGA, QFN or QFP are gaining ground. Because their connectors are mostly ...
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Inspection |
Brilliant image quality, easiest operation, comprehensive analysis.
Manual, semiautomatic or fully automatic X-ray inspection
Modular, low-maintenance all-metal tube
Flexible sample sizes up to 722 mm Ø
Variable angled radiation, simple ...
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Inspection |
Automatic, High Accuracy Desktop Wafer Inspection
For semiconductor assemblies, the requirement for a precise, thorough inspection for damage and defects during the production process is especially high. Wafers need non-destructive inspection of surface purity and evenness. Inspection...
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Inspection |
Highly Accurate Fully Automatic Wafer Inspection with Handling Unit
For semiconductor assemblies, the requirement for a precise, thorough inspection for damage and defects during the production process is especially high. Wafers need non-destructive inspection for surface purity and e...
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Inspection |