Chip Process Inc.
Lead Conditioning, Lead Scanning, Tape & Reel, Lead Tinning, Bake & Dry-Pack, BGA Reballing Services
Semiconductor finishing services which include Lead Conditioning (repair), Lead Scanning, Tape & Reel, Lead Tinning, Bake & Dry-Pack, BGA Reballing, Device Reclaim from Board Services. Also can be included under Lead Straightening and Lead Inspection category.
Device Reclaim from Board, BGA Reballing.
